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2.0 Basic Procedures More Guides
2.1 Handling Electronic Assemblies
2.1 Handling Electronic Assemblies
Covers the proper methods for safe handling of circuit boards assemblies.
2.2.1 Cleaning, Local
2.2.1 Cleaning, Local
Covers localized cleaning of circuit board assemblies using a solvent.
2.2.2 Cleaning, Aqueous Batch Process
2.2.2 Cleaning, Aqueous Batch Process
Covers cleaning circuit board assemblies using an aqueous batch process.
2.3.1 Coating Removal, Identification of Coating
2.3.1 Coating Removal, Identification of Coating
Covers methods to identify circuit board coatings and how to remove them.
2.3.2 Coating Removal, Solvent
2.3.2 Coating Removal, Solvent
Covers methods for coating and solder mask removal on printed circuit boards.
2.3.3 Coating Removal, Peeling
2.3.3 Coating Removal, Peeling
Covers removal of coatings on printed circuit boards by peeling.
2.3.4 Coating Removal, Thermal
2.3.4 Coating Removal, Thermal
Covers removal of coating from printed circuit boards using heat.
2.3.5 Coating Removal, Grinding/Scraping
2.3.5 Coating Removal, Grinding/Scraping
Covers use of various grinding and scraping tools to remove coatings.
2.3.6 Coating Removal, Micro Blasting
2.3.6 Coating Removal, Micro Blasting
Covers use of a micro abrasive blasting system to remove coatings.
2.4.1 Coating Replacement, Solder Mask
2.4.1 Coating Replacement, Solder Mask
Covers methods to replace solder mask.
2.4.2 Coating Replacement, Conformal Coating, Encapsulant
2.4.2 Coating Replacement, Conformal Coating, Encapsulant
Covers methods to replace conformal coatings.
2.4.3 Coating Replacement, Solder Mask, BGA Locations
2.4.3 Coating Replacement, Solder Mask, BGA Locations
Procedure covers methods to replace solder mask at BGA locations.
2.5 Baking and Preheating
2.5 Baking and Preheating
Covers baking and preheating of circuit boards.
2.6.1 Legend/Marking, Stamping
2.6.1 Legend/Marking, Stamping
Covers methods to repair legend using a stamp.
2.6.2 Legend Marking, Hand Lettering
2.6.2  Legend Marking, Hand Lettering
Covers methods to repair or add legend by hand lettering.
2.6.3 Legend Marking, Stencil
2.6.3 Legend Marking, Stencil
Covers methods to repair or add legend using a stencil.
2.7 Epoxy Mixing and Handling
2.7 Epoxy Mixing and Handling
Covers how to properly mixing and handling liquid epoxy used throughout these guides.
 
Procedure for reference only.
Customer Comments
"We had never considered sending our rework projects until recently. The cost savings since we started using Circuit Technology Center has been significant. I hope we never have such a massive rework project again, but if we, do you'll be the first to get a call"
N.C. Fort Wayne, IN USA
The Toughest Component Rework?
The Toughest Component Rework?
Rework of surface mount and through hole components can be a challenge. Our techs are ready to tackle your toughest rework projects.
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Challenging Surface Mount Pad Repair
Challenging Surface Mount Pad Repair
Surface mount and BGA pad repair are routine operations at Circuit Technology Center. Learn how it's done with absolute precision and reliably.
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BGA Component Rework Simplified
BGA Component Rework Simplified
When you have tough BGA rework, where do you turn to? Discover the nation's #1 contractor for outsourced BGA rework, repair and reballing.
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Can You Repair a Broken Corner?
Can You Repair a Broken Corner?
What happens to an assembled circuit board with a broken corner? Can it be repaired reliably? It can if you have the training and the experience.
Learn more ...
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Haverhill, MA 01835 USA
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