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3.3.2 Hole Repair, Transplant Method

  • This method is used to repair severe damage to a hole or to modify the size, shape or location of an unsupported tooling or mounting hole.
  • New hole is milled to encompass entire damaged area.
  • Place replacement dowel in position and bond with epoxy.
  • Cut off excess material and re-drill holes as required.
Outline
This method is used to repair severe damage to a hole or to modify the size, shape or location of an unsupported tooling or mounting hole. The hole may have component leads, wires, fasteners, pins, terminals or other hardware run through it. This repair method uses a dowel of matching board material and high strength epoxy to secure the dowel in place. After the new material is bonded in place a new hole can be drilled. This method can be used on single sided, double sided or multilayer circuit boards and assemblies.

Caution
Damaged inner-layer connections may require surface wire adds.


Proprietary Information Proprietary
This guide may contain proprietary or copyright-protected information for access by authorized persons only.

Minimum Skill Level - Expert
Recommended for technicians with advanced soldering and component rework skills and extensive experience in most repair/rework procedures.

Conformance Level - High
This procedure most closely duplicates the physical characteristics of the original, and most probably complies with all the functional, environmental and serviceability factors.

Acceptability References
IPC-A-600 2.0 Externally Observable Characteristics  Proprietary
IPC-A-610 10.0 Laminate Conditions  Proprietary
Procedure References
1.0 Foreword
2.1 Handling Electronic Assemblies
2.2 Cleaning
2.5 Baking And Preheating
2.7 Epoxy Mixing and Handling
IPC7721 3.3.2 Hole Repair, Transplant Method  Proprietary
Tools and Materials
CircuitMedic Part
Alcohol Swab
Self-saturating Isopropyl alcohol swab. Squeeze handle to release alcohol.
CircuitMedic Part
Ball Mills, Abrasives, Cutting Tools
Ball mills, abrasives and cutting tools for working on circuit boards.
Cleaner
Cleaner
General purpose cleaner for removing contamination.
CircuitMedic Part
Cleaning Brushes
Disposable brushes for use with solvents for cleaning and application of coatings.
End Mills
End Mills
Designed for end cutting and hole boring.
CircuitMedic Part
Circuit Bond Packs
Clear, superior strength epoxy in two-compartment plastic packages
CircuitMedic Part
File
High carbon steel needle file perfect for all kinds of detail work.
CircuitMedic Part
High Temp Tape Discs
High temperature polyimide tape discs, .50" diameter.
CircuitMedic Part
Knife with #16 Blades
A must-have tool for precise cutting, scraping and trimming.
Microscope
Microscope
Precision microscope with stand and lighting for work and inspection.
CircuitMedic Part
Micro Drill System
Versatile power tool for milling, drilling, grinding, cutting and sanding circuit boards.
Oven
Oven
General purpose oven for drying, baking and curing epoxies.
Drill
Precision Drill
Precision drill press for accuracy and controlled depth drilling.
CircuitMedic Part
Scraper
Hardened stainless steel tip for scraping solder mask and removing defects.
Wipes
Wipes
Nonabrasive, low-linting wipes for cleanup.
Images and Figures
3.3.2 Hole Repair, Transplant Method
Damaged Hole, Non Plated
3.3.2 Hole Repair, Transplant Method
Figure 1: New hole is milled to encompass entire damaged area.
3.3.2 Hole Repair, Transplant Method
Figure 2: Place replacement dowel in position and bond with epoxy.

3.3.2 Hole Repair, Transplant Method
Figure 3: Cut off excess material and re-drill holes as required.
3.3.2 Hole Repair, Transplant Method
Figure 4: Micro-Drill System.
Procedure
  1. Clean the area.
  2. Drill out the damaged or improperly sized hole using a carbide end mill or drill. Mill the hole using a precision drill press or milling machine for accuracy. The diameter of the cutting tool should be as small as possible yet still encompass the entire damaged area. (See Figure 1)

    Note
    Abrasion operations can generate electrostatic charges.
  3. Cut a piece of replacement base material rod. Base material rod is made from FR-4 dowel stock. Cut the length approximately 12.0 mm (0.50") longer than needed.
  4. Clean the reworked area.
  5. Use High Temperature Tape to protect exposed parts of the circuit board bordering the rework area.
  6. Mix the epoxy.
  7. Coat both the dowel and the hole with epoxy and fit together. Apply additional epoxy around perimeter of new material. (See Figure 2) Remove excess epoxy.
  8. Cure the epoxy per Procedure 2.7 Epoxy Mixing and Handling.

    Caution
    Some components may be sensitive to high temperatures.
  9. Remove the tape and cut off the excess material using the razor saw. Mill or file the dowel flush with the board surface. (See Figure 3)
  10. Complete the procedure by redrilling holes and adding circuitry as required. (See Figure 3)

    Note
    Apply surface coating to match prior coating as required.
  11. Clean the reworked area.
Evaluation
  1. Visual and dimensional examination of the reworked area for conformance to drawings and specifications.
Procedure for reference only.
 

Related Products

115-1322 Circuit Bond Kit
Kit containing packages of clear, low viscosity, superior strength epoxy for circuit board damage repair.
201-3110 Base Board Repair Kit
Kit to repair base board and laminate damage on circuit boards.
Color Agents
One part, air-drying, semi-paste ink for printing on hard surfaces and used to tint the color of epoxy.
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