2.2 Cleaning
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No. 2.2.1 Cleaning, Local
This procedure outlines local cleaning methods for circuit boards and assemblies.
No. 2.2.2 Cleaning, Aqueous Batch Process This procedure outlines a batch cleaning process for the removal of the small volumes of fluxes and other contaminants that may contact circuit boards during routine circuit board repair and rework operations.
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Procedure for reference only.
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