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2.2 Cleaning

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No. 2.2.1 Cleaning, Local
This procedure outlines local cleaning methods for circuit boards and assemblies.

No. 2.2.2 Cleaning, Aqueous Batch Process
This procedure outlines a batch cleaning process for the removal of the small volumes of fluxes and other contaminants that may contact circuit boards during routine circuit board repair and rework operations.
Procedure for reference only.