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8.0 Rework Procedures

Proprietary Information
This procedure contains proprietary information. The information is in a password protected folder for access by Circuit Technology Center, Inc. employees only.
8.0 Component Rework Procedures
List of component removal and rewok procedures including removal of through hole components, removal of chip components, removal of J lead components and removal of gull wing components.
8.1.1 Component Removal, Through Hole Components, Vacuum Method
Procedure covers removal of through hole components on assembled circuit boards.
8.1.2 Component Removal, Through Hole Components, Solder Fountain Method
Procedure covers removal of through hole components on assembled circuit boards.
8.2.1 Component Removal, Surface Mount Chip Components, Forked Tip Method
Procedure covers removal of surface mount chip components on assembled circuit boards.
8.2.2 Component Removal, Surface Mount Chip Components, Hot Tweezer Method
Procedure covers removal of surface mount chip components on assembled circuit boards.
8.3.1 Component Removal, Surface Mount J Lead Components, Conduction Method
Procedure covers removal of surface mount J lead components on assembled circuit boards.
8.3.2 Component Removal, Surface Mount J Lead Components, Hot Gas/Air Method
Procedure covers removal of surface mount J lead components on assembled circuit boards.
8.4.1 Component Removal, Surface Mount Gull Wing Components, Conduction Method
Procedure covers removal of surface mount gull wing components on assembled circuit boards.
8.4.2 Component Removal, Surface Mount Gull Wing Components, Hot Gas/Air Method
Procedure covers removal of surface mount gull wing components on assembled circuit boards.
Procedure for reference only.
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"Circuit Technology Center is the first repair and rework company that has been able to get our boards right the first time. Your hassle-free process has helped my own company stay on track. Thanks so much."
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