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9.0 BGA Component Rework and Reballing Procedures

9.0 BGA Component Rework Procedures
List of procedures covering BGA component rework on assembled circuit boards.
9.1.1 BGA Component Rework Process Flow
The procedure covers BGA component rework process flow instructions.
9.1.2 BGA Component Rework Inspection
The procedure covers BGA component rework inspection instructions.
9.1.3 BGA Component Reball Inspection
The procedure outlines the inspection method and pass/fail criteria for inspection of BGA component deballing and reballing.
9.2.1 BGA Component Rework Profile Development, Standard Method
The procedure covers steps involved in BGA component rework on assembled circuit boards.
9.2.2 BGA Component Rework Profile Development, Smart Track Method
The procedure covers steps involved in BGA component rework on assembled circuit boards.
9.3.1 BGA Component Rework
The procedure covers steps involved in BGA component rework on assembled circuit boards.
9.4.1 BGA Component Reballing, Fixture Method
The procedure covers BGA component reballing.
9.4.2 BGA Component Reballing, Braid Ball Removal, Reflow Oven Attachment Method
The procedure covers BGA component reballing.
9.4.3 BGA Component Reballing, Robotic Ball Removal, Mini-Oven Attachment Method
The procedure covers BGA component reballing.
9.4.4 BGA Component Reballing, Robotic Ball Removal Reflow, Reflow Oven Attachment Method
The procedure covers BGA component reballing.
9.5.1 BGA Component Removal, Machining Method
The procedure covers the process of removing a BGA component that was installed using a non-reworkable underfill.
Procedure for reference only.