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9.1.3 BGA Component Reball Inspection

  • Missing solder spheres. Reject.
  • Grazed or nicked spheres. Reject - violates sphere dimensional tolerances.
  • Crushed solder spheres. Reject.
  • Foreign object debris and flux residue. Reject.
  • Sphere off-center or sheared. Reject.
  • Irregular shaped sphere. Reject if violates sphere dimensional tolerances.
Outline
This page serves as a reference guide for inspection of reballed BGA components.

Proprietary Information Proprietary
This guide may contain proprietary or copyright-protected information for access by authorized persons only.

Minimum Skill Level - Expert
Recommended for technicians with advanced soldering and component rework skills and extensive experience in most repair/rework procedures.

Conformance Level - High
This procedure most closely duplicates the physical characteristics of the original, and most probably complies with all the functional, environmental and serviceability factors.

Procedure References
1.0 Foreword
2.1 Handling Electronic Assemblies
2.2 Cleaning
2.5 Baking And Preheating
IPC 7711/7721 5.7.3 BGA Reballing Procedure - Fixture Method
IPC J-STD-033 Joint Industry Standard for Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Device
J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies
GEIA-STD-0006 Requirements for Using Solder Dip to Replace the Finish on Electronic Piece Parts
Tools and Materials
Cleaner
Cleaner
General purpose cleaner for removing contamination.
CircuitMedic Part
Cleaning Brushes
Disposable brushes for use with solvents for cleaning and application of coatings.
Cleaninjg System
Cleaning System
Batch or inline cleaning system for removing fluxes and contamination.
Gloves
Gloves
Disposable, puncture-resistant gloves designed for handling mild chemicals.
Microscope
Microscope
Precision microscope with stand and lighting for work and inspection.
Wipes
Wipes
Nonabrasive, low-linting wipes for cleanup.
Images and Figures
9.1.3 BGA Component Reball Inspection
Missing solder spheres. Reject.
9.1.3 BGA Component Reball Inspection
Grazed or nicked spheres. Reject - violates sphere dimensional tolerances.
9.1.3 BGA Component Reball Inspection
Crushed solder spheres. Reject.

9.1.3 BGA Component Reball Inspection
Foreign object debris and flux residue. Reject.
9.1.3 BGA Component Reball Inspection
Sphere off-center or sheared. Reject.
9.1.3 BGA Component Reball Inspection
Irregular shaped sphere. Reject if violates sphere dimensional tolerances.

This page serves as a reference guide for inspection of reballed BGA components.
Procedure for reference only.
 

Related Guides

9.4.1 BGA Component Reballing, Braid Ball Removal, Mini-Oven Attachment Method
Procedure covers steps involved in BGA component reballing.
9.4.2 BGA Component Reballing, Braid Ball Removal, Reflow Oven Attachment Method
Procedure covers steps involved in BGA component reballing.
9.4.3 BGA Component Reballing, Robotic Ball Removal, Mini-Oven Attachment Method
Procedure covers steps involved in BGA component reballing.
9.4.4 BGA Component Reballing, Robotic Ball Removal, Reflow Oven Attachment Method
Procedure covers steps involved in BGA component reballing.
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