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9.4.1 BGA Component Reballing, Braid Ball Removal, Mini-Oven Attachment Method

  • BGA component prior to reballing.
  • Remove existing solder spheres on BGA components using desolder braid.
  • Apply tacky flux to the flat BGA component pads using a brush.
  • Place the BGA component(s) into a fixture and cover with a stencil.
  • Stencils are custom made and will work most any BGA component configuration.
  • The Mini BGA Reball Oven is specifically designed to reflow BGA balls for BGA component reballing.
Outline
This procedure covers reballing of BGA components.

Proprietary Information Proprietary
This guide may contain proprietary or copyright-protected information for access by authorized persons only.

Minimum Skill Level - Expert
Recommended for technicians with advanced soldering and component rework skills and extensive experience in most repair/rework procedures.

Conformance Level - High
This procedure most closely duplicates the physical characteristics of the original, and most probably complies with all the functional, environmental and serviceability factors.

Acceptability References
IPC-A-610 Acceptability of Electronic Assemblies  Proprietary
Procedure References
1.0 Foreword
2.1 Handling Electronic Assemblies
2.2 Cleaning
2.5 Baking And Preheating
IPC J-STD-033 Joint Industry Standard for Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Device  Proprietary
Tools and Materials
CircuitMedic Part
Alcohol Swab
Self-saturating Isopropyl alcohol swab. Squeeze handle to release alcohol.
Cleaner
Cleaner
General purpose cleaner for removing contamination.
CircuitMedic Part
Cleaning Brushes
Disposable brushes for use with solvents for cleaning and application of coatings.
Cleaninjg System
Cleaning System
Batch or inline cleaning system for removing fluxes and contamination.
Desolder Braid
Desolder Braid
Woven copper wire designed to wick solder from surfaces and holes.
CircuitMedic Part
Foam Swab
Ideal for absorbing cleaning solvents, and applying color agents and epoxies.
Gloves
Gloves
Disposable, puncture-resistant gloves designed for handling mild chemicals.
Microscope
Microscope
Precision microscope with stand and lighting for work and inspection.
Oven
Oven
General purpose oven for drying, baking and curing epoxies.
Safety Glasses
Safety Glasses
Protect your eyes and your vision with proper safety glasses.
Solder Flux
Solder Flux   Proprietary
Used to prepare solder surfaces and to prevent formation of oxides during soldering.
Solder Paste
Solder Paste    Proprietary
Solder paste for component soldering and rework.
Solder Paste
Solder Spheres    Proprietary
Solder balls or spheres for BGA component reballing and rework.
Solderinmg Iron
Soldering Iron
Properly maintained soldering iron and properly sized soldering iron tips.
CircuitMedic Part
Tweezer, Point Tip
Fine point tweezers for precision work.
Wipes
Wipes
Nonabrasive, low-linting wipes for cleanup.
Proprietary Information
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Images and Figures
9.4.1 BGA Component Reballing, Braid Ball Removal, Mini-Oven Attachment Method
BGA component prior to reballing.
9.4.1 BGA Component Reballing, Braid Ball Removal, Mini-Oven Attachment Method
Figure 1. Remove existing solder spheres on BGA components using desolder braid.
9.4.1 BGA Component Reballing, Braid Ball Removal, Mini-Oven Attachment Method
Figure 2. Apply tacky flux to flat BGA component pads using a brush.

9.4.1 BGA Component Reballing, Braid Ball Removal, Mini-Oven Attachment Method
Figure 3. Place the BGA component(s) into a fixture and cover with the appropriate stencil.
Procedure - Braid Ball Removal
  1. Ensure all BGA components to be processed meet the requirements for acceptable moisture level.

    Note
    For information on baking and moisture level control see 2.5 Baking and Preheating
  2. Remove existing solder spheres on BGA components using desolder braid. Place the desolder braid on the balls to be removed and gently place the soldering iron on the desolder braid. Apply very light pressure to melt the solder balls. As the solder melts it will be drawn onto the copper desoldering braid by capillary action. Repeat as needed to remove all the solder balls. See Figure 1.
  3. Clean the BGA components with approved cleaning solution. Some cleaning solutions may be specified by customer or contract. Typical cleaning process uses a Cleaning Brush and Cleaner. Gently brush the surface until all evidence of flux and debris have been removed. Dry with a clean Wipe or blow off using an air gun.
Procedure - Mini-Oven Attachment
  1. Apply tacky flux to the flat BGA component pads using a Brush. Flux should be evenly applied across the entire BGA pad surface. Use minimal flux needed to fully cover the surface. Remove any excess flux. See Figure 2.
  2. Place the BGA component(s) into a fixture and cover with a matching stencil. Check to ensure the alignment is correct. See Figure 3.
  3. Place a quantity of the appropriate size Solder Spheres into the fixture and use a clean Cleaning Brush to distribute the Solder Spheres so they fill all the open apertures in the BGA Component Stencil. Check to be sure all the apertures are filled with only one solder sphere. Tilt the fixture and pour the excess Solder Spheres into a collection container for reuse.

    Note
    Avoid overloading the Solder Stencil with excess Solder Spheres as they may wedge under the stencil. This will make lifting the Stencil to remove any excess Solder Spheres difficult.
  4. Place the component and fixture into the Mini BGA Reflow Oven.
  5. Turn the Mini BGA Reflow Oven on and select the proper profile.

    Note
    If a profile has not been defined a profile will need to be created.
  6. Close the cover of the Mini BGA Reflow Oven and press the start button. The oven will go through the required preheat, reflow and cooling cycles.
  7. When the temperature has cooled below 100 ° C, use gloves and remove the reball fixture from the Mini BGA Reball Oven once. Allow the fixture and components to cool for one minutes to ensure package thermal stability prior to removing the BGA component from the fixture.
  8. Visually inspect the BGA components balls for proper alignment and appearance.
  9. Clean the BGA components in approved cleaning solution.
  10. Inspect the body of the BGA component for abnormalities.
  11. Inspect the BGA component for cleanliness.
Procedure for reference only.
 

Related Products

Flextac Rework Stencils
Flexible anti-static polymer film solder paste stencils with a residue-free adhesive backing.
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Customer Comments
"I just wanted to let you know, the 10 circuit boards that you touched up in the BGA area, all worked well. Thank you for your help. This is one happy customer."
G.C. Lowell, MA USA
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