7.0 Soldering Procedures

7.0 Soldering Procedures
List of procedures including soldering basics, preparation for soldering, solder joint acceptance criteria, soldering of through hole components, surface mount chip components, J lead components, and gull wing components.

7.1.1 Soldering Basics
Procedure covers the basic concepts for high quality soldering.

7.1.2 Preparation For Soldering And Component Removal
Procedure covers preparation for soldering.

7.1.3 Solder Joint Acceptance Criteria
Page covers solder joint acceptance criteria.

7.2.1 Soldering Through Hole Components, Point To Point Method
Procedure covers soldering of through hole components.

7.2.2 Soldering Through Hole Components, Solder Fountain Method
Procedure covers soldering of through hole components.

7.3.1 Soldering Surface Mount Chip Components, Point To Point Method
Procedure covers soldering of surface mount chip components.

7.3.2 Soldering Surface Mount Chip Components, Hot Gas Method
Procedure covers soldering of surface mount chip components.

7.4.1 Soldering Surface Mount J Lead Components Point To Point Method
Procedure covers soldering of surface mount J lead components.

7.4.2 Soldering Surface Mount J Lead Components Continuous Flow Method
Procedure covers soldering of surface mount J lead components.

7.4.3 Soldering Surface Mount J Lead Components Hot Gas Method
Procedure covers soldering of surface mount J lead components.

7.5.1 Soldering Surface Mount Gull Wing Components, Point To Point Method
Procedure covers soldering of surface mount gull wing components.

7.5.2 Soldering Surface Mount Gull Wing Components, Continuous Flow Method
Procedure covers soldering of surface mount gull wing components.

7.5.3 Soldering Surface Mount Gull Wing Components Hot Gas Method
Procedure covers soldering of surface mount gull wing components.

Procedure for reference only.

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