7.0 Soldering Procedures
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7.0 Soldering Procedures
List of procedures including soldering basics, preparation for soldering, solder joint acceptance criteria, soldering of through hole components, surface mount chip components, J lead components, and gull wing components.
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7.1.1 Soldering Basics
Procedure covers the basic concepts for high quality soldering.
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7.1.2 Preparation For Soldering And Component Removal
Procedure covers preparation for soldering.
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7.1.3 Solder Joint Acceptance Criteria
Page covers solder joint acceptance criteria.
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7.2.1 Soldering Through Hole Components, Point To Point Method
Procedure covers soldering of through hole components.
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7.2.2 Soldering Through Hole Components, Solder Fountain Method
Procedure covers soldering of through hole components.
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7.3.1 Soldering Surface Mount Chip Components, Point To Point Method
Procedure covers soldering of surface mount chip components.
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7.3.2 Soldering Surface Mount Chip Components, Hot Gas Method
Procedure covers soldering of surface mount chip components.
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7.4.1 Soldering Surface Mount J Lead Components Point To Point Method
Procedure covers soldering of surface mount J lead components.
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7.4.2 Soldering Surface Mount J Lead Components Continuous Flow Method
Procedure covers soldering of surface mount J lead components.
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7.4.3 Soldering Surface Mount J Lead Components Hot Gas Method
Procedure covers soldering of surface mount J lead components.
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7.5.1 Soldering Surface Mount Gull Wing Components, Point To Point Method
Procedure covers soldering of surface mount gull wing components.
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7.5.2 Soldering Surface Mount Gull Wing Components, Continuous Flow Method
Procedure covers soldering of surface mount gull wing components.
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7.5.3 Soldering Surface Mount Gull Wing Components Hot Gas Method
Procedure covers soldering of surface mount gull wing components.
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Procedure for reference only.
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