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4.1.1 Lifted Conductor Repair, Epoxy Method

  • This method is used to rebond a lifted circuit. Liquid epoxy is inserted under and around the circuit to bond it back down to the circuit board surface.
  • Apply a small amount of epoxy under the entire length of the lifted circuit.
  • Completed repair.
Outline
This method is used to rebond a lifted circuit. Liquid epoxy is inserted under and around the circuit to bond it back down to the circuit board surface.

Caution
This method should not be used to rebond a circuit that has been stretched or damaged.

Proprietary Information Proprietary
This guide may contain proprietary or copyright-protected information for access by authorized persons only.

Minimum Skill Level - Intermediate
Recommended for technicians with skills in basic soldering and component rework, but may be inexperienced in general repair/rework procedures.

Conformance Level - High
This procedure most closely duplicates the physical characteristics of the original, and most probably complies with all the functional, environmental and serviceability factors.

Acceptability References
IPC-A-600 2.0 Externally Observable Characteristics  Proprietary
IPC-A-610 10.0 Laminate Conditions  Proprietary
Procedure References
1.0 Foreword
2.1 Handling Electronic Assemblies
2.2 Cleaning
2.5 Baking And Preheating
2.7 Epoxy Mixing and Handling
IPC7721 4.1.1 Lifted Conductor Repair, Epoxy Seal Method  Proprietary
Tools and Materials
CircuitMedic Part
Alcohol Swab
Self-saturating Isopropyl alcohol swab. Squeeze handle to release alcohol.
Cleaner
Cleaner
General purpose cleaner for removing contamination.
CircuitMedic Part
Cleaning Brushes
Disposable brushes for use with solvents for cleaning and application of coatings.
Coatings
Color Agents
Use to tint the color of epoxy used for solder mask repair or circuit base board repair.
CircuitMedic Part
Circuit Bond Packs
Clear, superior strength epoxy in two-compartment plastic packages
CircuitMedic Part
Foam Swab
Ideal for absorbing cleaning solvents, and applying color agents and epoxies.
CircuitMedic Part
High Temp Tape Discs
High temperature polyimide tape discs, .50" diameter.
CircuitMedic Part
Knife with #16 Blades
A must-have tool for precise cutting, scraping and trimming.
CircuitMedic Part
Micro Probes
Use to dispense a minute amount of adhesive and for micro-positioning of small objects.
Oven
Oven
General purpose oven for drying, baking and curing epoxies.
CircuitMedic Part
Probe
Sharp dental style probe for manipulating small objects and removal of small debris.
CircuitMedic Part
Scraper
Hardened stainless steel tip for scraping solder mask and removing defects.
CircuitMedic Part
Syringes
Polypropylene syringe barrels with stainless steel dispensing tips.
CircuitMedic Part
Tweezer, Point Tip
Fine point tweezers for precision work.
Wipes
Wipes
Nonabrasive, low-linting wipes for cleanup.
Images and Figures
4.1.1 Lifted Conductor Repair, Epoxy Method
4.1.1 Lifted Conductor Repair, Epoxy Method
Figure 1: Apply a small amount of epoxy under the entire length of the lifted circuit.
4.1.1 Lifted Conductor Repair, Epoxy Method
Figure 2: Completed repair.

Procedure
  1. Clean the area.
  2. Remove any obstructions that prevent the lifted circuit from making contact with the base board surface.

    Caution
    Be careful while cleaning and removing all obstructions, not to stretch or damage the lifted conductor.
  3. Clean the area.
  4. Mix the epoxy.
  5. Carefully apply a small amount of epoxy under the entire length of the lifted circuit. The tip of a knife may be used to apply the epoxy. (See Figure 1)
  6. Press the lifted circuit down into the epoxy and into contact with the base board material.
  7. Apply additional epoxy to the surface of the lifted circuit and to all sides as needed. Cure the epoxy per Procedure 2.7 Epoxy Mixing and Handling.

    Caution
    Some components may be sensitive to high temperature.
  8. Apply surface coating to match prior coating as required.
Evaluation
  1. Visual examination and tape test per IPC-TM-650 (ANSI/IPC-FC-250A) test method 2.4.1.
  2. Electrical tests as applicable.
Procedure for reference only.
 

Related Products

115-1322 Circuit Bond Kit
Kit containing packages of clear, low viscosity, superior strength epoxy for circuit board damage repair.
Color Agents
One part, air-drying, semi-paste ink for printing on hard surfaces and used to tint the color of epoxy.
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