This method is used to rebond a lifted circuit. Liquid epoxy is inserted under and around the circuit to bond it back down to the circuit board surface.
This method should not be used to rebond a circuit that has been stretched or damaged.
Minimum Skill Level - Intermediate
Recommended for technicians with skills in basic soldering and component rework, but may be inexperienced in general repair/rework procedures.
Conformance Level - High
This procedure most closely duplicates the physical characteristics of the original, and most probably complies with all the functional, environmental and serviceability factors.