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7.2.1 Soldering Through Hole Components, Point To Point Method
Outline
This procedure covers the general guidelines for soldering through hole components using a point to point soldering method. There is basically only one style of through hole component. Whether there are a few leads or many or whether the component is large or small the soldering principles are the same.

Minimum Skill Level - Intermediate
Recommended for technicians with skills in basic soldering and component rework, but may be inexperienced in general repair/rework procedures.

Conformance Level - Medium
This procedure may have some variance with the physical character of the original and most likely varies with some of the functional, environmental and serviceability factors.

Procedure References
1.0 Foreword
2.1 Handling Electronic Assemblies
2.2 Cleaning
2.5 Baking And Preheating
7.1.1 Soldering Basics
7.1.2 Preparation For Soldering And Component Removal
7.1.3 Solder Joint Acceptability Criteria
IPC7711 7.2.1 Soldering Through Hole Components, Point To Point Method
Tools and Materials
Cleaner
Cleaner
General purpose cleaner for removing contamination.
Microscope
Microscope
It is a challenge to undertake precision repair without a good microscope.
Soldering Iron
Soldering Iron, Solder and Flux
A well maintained soldering iron is a must at every tech bench.
Wipes
Wipes
Nonabrasive, low-linting wipes for cleanup.
Images and Figures
7.2.1 Soldering Through Hole Components, Point To Point Method
Through Hole Component
7.2.1 Soldering Through Hole Components, Point To Point Method
Figure 1: Apply solder at the junction of soldering iron tip and lead to make a solder bridge.
7.2.1 Soldering Through Hole Components, Point To Point Method
Figure 2: Feed solder into the joint from the side opposite from the iron tip until the proper fillet is achieved.

Procedure 
  1. If needed, form the component and clean the area.

  2. Insert the component into the plated hole. If needed, secure in place by bending leads or other mechanical means.

  3. If needed, apply liquid flux to the plated holes and pads.

  4. Place the soldering iron tip at the junction between the pad and component lead. Apply a small amount of solder at the junction of soldering iron tip and lead to make a solder bridge. (See Figure 1)

    Note
    The size of the solder is important when soldering small components. If the solder is too large, it is easy to melt too much solder into the joint. If the solder is too small, it can take too long to melt the optimum amount into the joint.

    Caution
    Avoid exerting any pressure on the pad.

  5. Immediately feed solder into the joint from the side opposite from the soldering iron tip until the proper fillet is achieved. Remove the solder then remove the iron. The iron may be swept over the end of the component lead to cover it with solder. (See Figure 2)

    Note
    Apply the solder to the side opposite from the soldering iron tip so that the work surfaces and not the iron will melt the solder.

  6. On multiple lead components solder the opposite corners first to stabilize the component. Follow by soldering the remaining leads in a random pattern to reduce excessive heat buildup in one area.

  7. Clean the flux residue, if required and inspect.

Procedure for reference only.