Surgeon grade rework and repair, by the book and guaranteed.®
Newsletter | Contact Us
Phone: 978-374-5000
  

7.2.1 Soldering Through Hole Components, Point To Point Method

  • This procedure covers the general guidelines for soldering through hole components using a point to point soldering method.
  • Apply solder at the junction of soldering iron tip and lead to make a solder bridge.
  • Feed solder into the joint from the side opposite from the iron tip until the proper fillet is achieved.
Outline
This procedure covers the general guidelines for soldering through hole components using a point to point soldering method. There is basically only one style of through hole component. Whether there are a few leads or many or whether the component is large or small the soldering principles are the same.

Proprietary Information Proprietary
This guide may contain proprietary or copyright-protected information for access by authorized persons only.

Minimum Skill Level - Intermediate
Recommended for technicians with skills in basic soldering and component rework, but may be inexperienced in general repair/rework procedures.

Conformance Level - Medium
This procedure may have some variance with the physical character of the original and most likely varies with some of the functional, environmental and serviceability factors.

Procedure References
1.0 Foreword
2.1 Handling Electronic Assemblies
2.2 Cleaning
2.5 Baking And Preheating
7.1.1 Soldering Basics
7.1.2 Preparation For Soldering And Component Removal
7.1.3 Solder Joint Acceptability Criteria
IPC7711 7.2.1 Soldering Through Hole Components, Point To Point Method
Tools and Materials
Cleaner
Cleaner
General purpose cleaner for removing contamination.
Microscope
Microscope
Precision microscope with stand and lighting for work and inspection.
Solderinmg Iron
Soldering Iron
Properly maintained soldering iron and properly sized soldering iron tips.
Wipes
Wipes
Nonabrasive, low-linting wipes for cleanup.
Images and Figures
7.2.1 Soldering Through Hole Components, Point To Point Method
Through Hole Component
7.2.1 Soldering Through Hole Components, Point To Point Method
Figure 1: Apply solder at the junction of soldering iron tip and lead to make a solder bridge.
7.2.1 Soldering Through Hole Components, Point To Point Method
Figure 2: Feed solder into the joint from the side opposite from the iron tip until the proper fillet is achieved.

Procedure
  1. If needed, form the component and clean the area.
  2. Insert the component into the plated hole. If needed, secure in place by bending leads or other mechanical means.
  3. If needed, apply liquid flux to the plated holes and pads.
  4. Place the soldering iron tip at the junction between the pad and component lead. Apply a small amount of solder at the junction of soldering iron tip and lead to make a solder bridge. (See Figure 1)

    Note
    The size of the solder is important when soldering small components. If the solder is too large, it is easy to melt too much solder into the joint. If the solder is too small, it can take too long to melt the optimum amount into the joint.

    Caution
    Avoid exerting any pressure on the pad.
  5. Immediately feed solder into the joint from the side opposite from the soldering iron tip until the proper fillet is achieved. Remove the solder then remove the iron. The iron may be swept over the end of the component lead to cover it with solder. (See Figure 2)

    Note
    Apply the solder to the side opposite from the soldering iron tip so that the work surfaces and not the iron will melt the solder.
  6. On multiple lead components solder the opposite corners first to stabilize the component. Follow by soldering the remaining leads in a random pattern to reduce excessive heat buildup in one area.
  7. Clean the flux residue, if required and inspect.
Procedure for reference only.
Questions / Comments?
Call 978-374-5000 or submit your questions, comments and requests using the form below.

Your Name


Your E-mail


Your Phone


Your Company


Your Country


Send us a file

Maximum file size 4 megabytes.

Questions/Comments



Customer Comments
"Thanks again for doing a GREAT JOB! Pass my thanks along to all involved."
L.S. Dayton, OH USA
87 Repair/Rework Guides Free Online
87 Repair/Rework Guides Free Online
This free online guidebook, packed with detailed illustrations, will be helpful to anyone who needs to repair or rework circuit board assemblies.
Learn more ...
Keep This Plated-Hole Kit Handy
Keep This Plated-Hole Kit Handy
Plated holes in circuit boards are easily damaged. This kit includes all the tools and materials needed to repair damaged plated through holes.
Learn more ...
Are Your BGA Rework Techs Experts?
Are Your BGA Rework Techs Experts?
Can every operator handle your BGA rework equally well? In real life, in all but just a few situations, the answer is no. Why is this so?
Learn more ...
Jumper Wire Hassles Eliminated
Jumper Wire Hassles Eliminated
Throw away that super glue and eliminate that super glue mess. Clean up your act when bonding wires. Wire Dots make the job clean, neat and fast.
Learn more ...
About Us | Base Board Repair | BGA Reballing | BGA Rework | Coating/Marking | Circuit Repair | Component Salvage | Conflict Minerals | Contact Us | Copyright/Disclaimer | Directions | ECO/Modification | Feature Articles | Frequent Questions | Gold Contacts | Inspection | Order Tracking | Newsletter | Plated Hole Repair | Prices, Terms, Delivery | Products | Privacy | REACH | RoHS | Services | SMT/BGA Repair | SMT/PTH Rework | Sitemap

Circuit Technology Center, Inc.
22 Parkridge Road
Haverhill, MA 01835 USA
Copyright © Circuit Technology Center, Inc.. All rights reserved.