Robotic deball system for controlled removal of solder balls. See video above.
Apply tacky flux to the flat BGA component pads using a brush.
Place the BGA component(s) into a fixture and cover with a stencil.
Stencils are custom made and will work most any BGA component configuration.
The Mini BGA Reball Oven is specifically designed to reflow BGA balls for BGA component reballing.
This procedure covers reballing of BGA components.
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Minimum Skill Level - Expert
Recommended for technicians with advanced soldering and component rework skills and extensive experience in most repair/rework procedures.
Conformance Level - High
This procedure most closely duplicates the physical characteristics of the original, and most probably complies with all the functional, environmental and serviceability factors.
Place a matrix tray of the BGA components into the Robotic BGA Deball system. See Figure 1.
Refer to component datasheet for guidelines regarding component peak temperatures specifications, etc.
Run the BGA components through the de-ball cycle. This process dissolves and flushes away the existing solder balls. See video above.
A. Fluxing of the components.
B. Controlled pre-heating of components.
C. Ball removal using a dynamic solder wave.
D. Component rinse and blow off.
As required, clean the BGA components with approved cleaning solution. Dry components as required.
Procedure - Mini-Oven Attachment Method
Apply tacky flux to the flat BGA component pads using a Brush. Flux should be evenly applied across the entire BGA pad surface. Use minimal flux needed to fully cover the surface. Remove any excess flux. See Figure 2.
Place a quantity of the appropriate size Solder Spheres into the fixture and use a clean Cleaning Brush to distribute the Solder Spheres so they fill all the open apertures in the BGA Component Stencil. Check to be sure all the apertures are filled with only one solder sphere. Tilt the fixture and pour the excess Solder Spheres into a collection container for reuse. See Figure 3.
Note Avoid overloading the Solder Stencil with excess Solder Spheres as they may wedge under the stencil. This will make lifting the Stencil to remove any excess Solder Spheres difficult.
Place the component and fixture into the Mini BGA Reflow Oven. See Figure 4.
Turn the Mini BGA Reflow Oven on and select the proper profile.
If a profile has not been defined a profile will need to be created.
Close the cover of the Mini BGA Reflow Oven and press the start button. The oven will go through the required preheat, reflow and cooling cycles.
When the temperature has cooled below 100 ° C, use gloves and remove the reball fixture from the Mini BGA Reball Oven once. Allow the fixture and components to cool for one minutes to ensure package thermal stability prior to removing the BGA component from the fixture.
Visually inspect the BGA components balls for proper alignment and appearance.
Clean the BGA components in approved cleaning solution.
Inspect the body of the BGA component for abnormalities.