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9.1.2 BGA Component Rework Inspection

Outline
This document covers BGA component rework inspection instructions.

Minimum Skill Level - Advanced
Recommended for technicians with soldering and component rework skills and exposure to most repair/rework procedures, but lacking extensive experience.

Conformance Level - High
This procedure most closely duplicates the physical characteristics of the original, and most probably complies with all the functional, environmental and serviceability factors.

Procedure References
1.0 Foreword
2.1 Handling Electronic Assemblies
2.2 Cleaning
2.5 Baking And Preheating
Tools and Materials
Images and Figures
9.1.2  BGA Component Rework Inspection
Ball Grid Array Rework Station
Introduction
This document has been prepared by Circuit Technology Center, Inc.. The purpose is to ensure repeatable, high quality rework of BGA components, and to assure conformity to the highest industry standards and specifications.

Note
This document covers procedure and guidelines specific to BGA component rework conducted by the staff at Circuit Technology Center, Inc. Organizations using this information may need to make modifications, or other changes, to accomodate their own particular needs.

Note
This document is under development. Refer to available industry sources including recommendations from IPC while this document is being developed.
Procedure for reference only.
Customer Comments
"Circuit Technology Center is the first repair and rework company that has been able to get our boards right the first time. Your hassle-free process has helped my own company stay on track. Thanks so much."
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