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4.0 Conductor Procedures

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4.0 Conductor Procedures
List of procedures to repair lifted and damaged conductors, circuits, lands, surface mount pads, gold edge contacts, BGA pads, cut surface and internal circuits and conductors, and rework and modify plated holes.
4.1.1 Lifted Conductor Repair, Epoxy Method
Procedure to repair lifted conductors and circuits.
4.1.2 Lifted Conductor Repair, Film Adhesive Method
Procedure to repair lifted conductors and circuits.
4.2.1 Conductor Repair, Foil Jumper, Epoxy Method
Procedure to repair damaged conductors and circuits.
4.2.2 Conductor Repair, Foil Jumper, Film Adhesive Method
Procedure to repair damaged conductors and circuits.
4.2.3 Conductor Repair, Welding Method
Procedure to repair damaged conductors and circuits.
4.2.4 Conductor Repair, Surface Wire Method
Procedure to repair damaged conductors and circuits.
4.2.5 Conductor Repair, Through Board Wire Method
Procedure to repair damaged conductors and circuits.
4.2.6 Conductor Repair, Inner Layer Method
Procedure to repair damaged conductors and circuits.
4.2.7 Conductor Repair, Surface Plane, Film Adhesive Method
Procedure to repair damaged conductors and circuits.
4.3.1 Circuit Cut, Surface Circuits
Procedure to cut conductors and circuits.
4.3.2 Circuit Cut, Inner Layer Circuits
Procedure to cut conductors and circuits.
4.3.3 Deleting Inner Layer Connection at a Plated Hole, Drill Through
Procedure to cut conductors and circuits.
4.3.4 Deleting Inner Layer Connection at a Plated Hole, Spoke Cut Method
Procedure to cut conductors and circuits.
4.4.1 Lifted Land Repair, Epoxy Seal Method
Procedure to repair lifted and damaged lands.
4.4.2 Lifted Land Repair, Film Adhesive Method
Procedure to repair lifted and damaged lands.
4.5.1 Land Repair, Epoxy Method
Procedure to repair lifted and damaged lands.
4.5.2 Land Repair, Film Adhesive Method
Procedure to repair lifted and damaged lands.
4.6.1 Edge Contact Repair, Epoxy Method
Procedure to repair lifted and damaged gold edge contacts.
4.6.2 Edge Contact Repair, Film Adhesive Method
Procedure to repair lifted and damaged gold edge contacts.
4.6.3 Edge Contact Repair/Rework, Plating Method
Procedure to repair and replate scratched, damaged and solder contaminated gold edge contacts.
4.7.1 Surface Mount Pad Repair, Epoxy Method
Procedure to repair damaged and lifted surface mount pads.
4.7.2 Surface Mount Pad Repair, Film Adhesive Method
Procedure to repair damaged and lifted surface mount pads.
4.7.3 Surface Mount, BGA Pad Repair, Film Adhesive Method
Procedure to repair damaged and lifted surface mount and BGA pads.
4.7.4 Surface Mount, BGA Pad with Integral Via Repair
Procedure to repair damaged and lifted surface mount and BGA pads.
4.7.5 Surface Mount, BGA Pad with Integral Via Repair Circuit Extension Method
Procedure to repair damaged and lifted surface mount and BGA pads.
Procedure for reference only.
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Customer Comments
"I just wanted to let you know, the 10 circuit boards that you touched up in the BGA area, all worked well. Thank you for your help. This is one happy customer."
G.C. Lowell, MA USA
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