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6.4 Component Lead Cutting and Lifting
Outline
This procedure covers the general guidelines for modifications that involve cutting and lifting component leads. Leads may be permanently cut or lifted due to engineering changes, or reconnected if done for testing purposes.

Minimum Skill Level - Advanced
Recommended for technicians with soldering and component rework skills and exposure to most repair/rework procedures, but lacking extensive experience.

Conformance Level - Medium
This procedure may have some variance with the physical character of the original and most likely varies with some of the functional, environmental and serviceability factors.

Procedure References
1.0 Foreword
2.1 Handling Electronic Assemblies
2.2 Cleaning
6.1 Jumper Wires
Tools and Materials
Cleaner
Cleaner
General purpose cleaner for removing contamination.
Cutters
Cutter and Pliers
Precision grade cutters and pliers.
Microscope
Microscope
It is a challenge to undertake precision repair without a good microscope.
CircuitMedic Part
Mixing Picks
Unique mixing sticks have a paddle shape on one and sharp pick on the opposite end.
CircuitMedic Part
Probe
Sharp dental style probe for manipulating small objects and removal of small debris.
Soldering Iron
Soldering Iron, Solder and Flux
A well maintained soldering iron is a must at every tech bench.
Wipes
Wipes
Nonabrasive, low-linting wipes for cleanup.
Images and Figures
6.4 Component Lead Cutting and Lifting
Figure 1: Component Lead Cutting
6.4 Component Lead Cutting and Lifting
Figure 2: Specially designed cutters used to cut component leads.
6.4 Component Lead Cutting and Lifting
Figure 3: Place the cutter at the mid point in the lead and snip through to cut the lead.
6.4 Component Lead Cutting and Lifting
Figure 4: To ensure that the lead has been severed, the upper portion of the lead may be slightly lifted using a pick.
6.4 Component Lead Cutting and Lifting
Figure 5: If needed, solder both halves of the severed lead together.
6.4 Component Lead Cutting and Lifting
Figure 6: Place the cutter at the mid point in the lead and snip through to cut the lead.
6.4 Component Lead Cutting and Lifting
Figure 7: To ensure that the lead has been severed, the upper portion of the lead may be slightly lifted using a pick.
6.4 Component Lead Cutting and Lifting
Figure 8: If needed, solder both halves of the severed lead together.
6.4 Component Lead Cutting and Lifting
Figure 9: Gently place a pick behind the component lead to be lifted. Apply a soldering iron tip to the foot of the component lead. Apply slight force with the pick to lift the lead as the soldering iron reflows the joint.
6.4 Component Lead Cutting and Lifting
Figure 10: Visually inspect, or electrically test, to ensure that the lead has been lifted.
6.4 Component Lead Cutting and Lifting
Figure 11: Gently place a pick behind the component lead to be lifted. Apply a soldering iron tip to the foot of the component lead. Apply slight force with the pick to lift the lead as the soldering iron reflows the joint.
6.4 Component Lead Cutting and Lifting
Figure 1: Component Lead Cutting

Note
Specially designed cutters are required when cutting component leads. 

Procedure - Lead Cutting, Plated Through Hole Components
  1. Select the component lead that needs to be cut and place the cutter in position. (See Figure 3) Place the cutter at the mid point in the lead and snip through to cut the lead.

  2. To ensure that the lead has been severed, the upper portion of the lead may be slightly lifted using a pick. Visually inspect, or electrically test, to ensure that the lead has been severed.

  3. If the lead needs to be reconnected, gently push the upper portion of the severed lead down until it touches the lower portion of the severed lead.

  4. Solder both halves of the severed lead together. (See Figure 5)

    Note
    The lower portion of the lead may move during soldering since it is not anchored in position.

  5. If required, clean the flux residue and inspect.
Procedure - Lead Cutting, J Lead Components
  1. Select the component lead that needs to be cut and place the cutter in position. (See Figure 6) Place the cutter at the mid point in the lead and snip through to cut the lead.

  2. To ensure that the lead has been severed, the upper portion of the lead may be slightly lifted using a pick. (See Figure 7) Visually inspect, or electrically test, to ensure that the lead has been severed.

  3. If the lead needs to be reconnected, gently push the upper portion of the severed lead down until it touches the lower portion of the severed lead.

  4. Solder both halves of the severed lead together. (See Figure 8)

    Note
    The lower portion of the lead may move during soldering since it is not anchored in position.

  5. If required, clean the flux residue and inspect.
Procedure - Lead Lifting, Standard Gull Wing Components
  1. Select the component lead that needs to be lifted. Apply a soldering iron and solder braid to remove the excess solder from the joint.

  2. Gently place a pick behind the component lead to be lifted. Apply a soldering iron tip to the foot of the component lead. Apply slight force with the pick to lift the lead as the soldering iron reflows the joint. (See Figure 9)

  3. Visually inspect, or electrically test, to ensure that the lead has been lifted. See (Figure 10)

  4. If the lead needs to be reconnected, gently push the lead down until it touches the pad and solder.

  5. If required, clean the flux residue and inspect.
Procedure - Lead Lifting, Fine Pitch Gull Wing Components
  1. Select the component lead that needs to be lifted. Apply a soldering iron and solder braid to remove the excess solder from the joint.

  2. Gently place a pick behind the component lead to be lifted. Apply a soldering iron tip to the foot of the component lead. Apply slight force with the pick to lift the lead as the soldering iron reflows the joint. (See Figure 11)

  3. Visually inspect, or electrically test, to ensure that the lead has been lifted. See (Figure 12)

  4. If the lead needs to be reconnected, gently push the lead down until it touches the pad and solder.

  5. If required, clean the flux residue and inspect.

Procedure for reference only.