Surgeon grade rework and repair, by the book and guaranteed.®
Newsletter | Contact Us
Phone: 978-374-5000
  

7.3.2 Soldering Surface Mount Chip Components, Hot Gas Method Method

  • This procedure covers the general guidelines for soldering surface mount chip components.
  • Add a small bead of solder paste to each pad.
  • Move the tool back and forth to heat both solder joints until complete solder melt is observed.
Outline
This procedure covers the general guidelines for soldering surface mount chip components. The following surface mount chip components are covered by this procedure. While all of these components are different, the techniques for soldering are relatively similar

Chip Resistors
The component body of chip resistors is made out of alumna; an extremely hard, white colored material. The resistive material is normally located on the top. Chip resistors are usually mounted with the resistive element facing upwards to help dissipate heat.

Ceramic Capacitors
These components are constructed from several layers of ceramic with internal metallized layers. Because metal heats up much faster than ceramic, ceramic capacitors need to be heated slowly to avoid internal separations between the ceramic and the metal layers. Internal damage will not generally be visible, since any cracks will be inside the ceramic body of the component.

Note
Avoid rapid heating of ceramic chip capacitors during soldering operations.

Plastic Body
Another style of chip component has a molded plastic body that protects the internal circuitry. There are a number of different types of components that share this type of exterior package. The termination styles for plastic chip component packages vary considerably.

MELF
MELF - Metal Electrode Face cylindrical components. These may be capacitors, resistors, and diodes. It can be hard to tell them apart - since there is no universal coloring or component designators printed on the component bodies.

Minimum Skill Level - Intermediate
Recommended for technicians with skills in basic soldering and component rework, but may be inexperienced in general repair/rework procedures.

Conformance Level - Medium
This procedure may have some variance with the physical character of the original and most likely varies with some of the functional, environmental and serviceability factors.

Acceptability References
IPC-A-610 12.0 Surface Mount Assemblies
Procedure References
1.0 Foreword
2.1 Handling Electronic Assemblies
2.2 Cleaning
2.5 Baking And Preheating
7.1.1 Soldering Basics
7.1.2 Preparation For Soldering And Component Removal
7.1.3 Solder Joint Acceptability Criteria
IPC7711 5.3.1 Solder Paste Method
Tools and Materials
Images and Figures
7.3.2 Soldering Surface Mount Chip Components, Hot Gas Method Method
Surface Mount Chip Component
7.3.2 Soldering Surface Mount Chip Components, Hot Gas Method Method
Figure 1: Add a small bead of solder paste to each pad.
7.3.2 Soldering Surface Mount Chip Components, Hot Gas Method Method
Figure 2: Move the tool back and forth to heat both solder joints until complete solder melt is observed.

7.3.2 Soldering Surface Mount Chip Components, Hot Gas Method Method
Chip Capacitors generally have solid color bodies.
7.3.2 Soldering Surface Mount Chip Components, Hot Gas Method Method
A - Stripe
Procedure
  1. Add a small bead of solder paste to each pad. (See Figure 1)
  2. Place the component in position.
  3. Adjust the pressure and temperature output of the hot air tool.
  4. Direct the hot air over the component with the hot air tool tip approximately 2.50 cm (1.00") from the solder joint. This initial heating will pre-dry the solder paste.

    Note
    When the solder paste has pre-dried, the paste will have a dull flat appearance.
  5. When the solder paste has dried, move the hot air tool tip to approximately 0.50 cm (0.20") above the component. Move the tool back and forth to heat both solder joints until complete solder melt is observed. (See Figure 2)
  6. Remove the tool. Wait a moment for the solder to solidify.
  7. Clean, if required and inspect.
Procedure for reference only.
Questions / Comments?
Call 978-374-5000 or submit your questions, comments and requests using the form below.

Your Name


Your E-mail


Your Phone


Your Company


Your Country


Send us a file

Maximum file size 4 megabytes.

Questions/Comments



Customer Comments
"Circuit Technology Center is the first repair and rework company that has been able to get our boards right the first time. Your hassle-free process has helped my own company stay on track. Thanks so much."
P.B. Dublin GA, USA
The Toughest Component Rework?
The Toughest Component Rework?
Rework of surface mount and through hole components can be a challenge. Our techs are ready to tackle your toughest rework projects.
Learn more ...
Challenging Surface Mount Pad Repair
Challenging Surface Mount Pad Repair
Surface mount and BGA pad repair are routine operations at Circuit Technology Center. Learn how it's done with absolute precision and reliably.
Learn more ...
BGA Component Rework Simplified
BGA Component Rework Simplified
When you have tough BGA rework, where do you turn to? Discover the nation's #1 contractor for outsourced BGA rework, repair and reballing.
Learn more ...
Can You Repair a Broken Corner?
Can You Repair a Broken Corner?
What happens to an assembled circuit board with a broken corner? Can it be repaired reliably? It can if you have the training and the experience.
Learn more ...
About Us | Base Board Repair | BGA Reballing | BGA Rework | Coating/Marking | Circuit Repair | Component Salvage | Conflict Minerals | Contact Us | Copyright/Disclaimer | Directions | ECO/Modification | Feature Articles | Frequent Questions | Gold Contacts | Intranet | Inspection | Order Tracking | Newsletter | Plated Hole Repair | Prices, Terms, Delivery | Products | Privacy | REACH | RoHS | Services | SMT/BGA Repair | SMT/PTH Rework | Sitemap

Circuit Technology Center, Inc.
22 Parkridge Road
Haverhill, MA 01835 USA
Copyright © Circuit Technology Center, Inc.. All rights reserved.