BGA Component Milling

QUICK QUESTION?

Have a general inquiry?
Send us a message below.

Submit a quote request using our quote form.

First Name *

Last Name *

Email *

Phone Number

Job Title

Company Name *

How Can We Help? *

File Upload

To upload multiple files, select them together using Ctrl-click on Windows or Command-click on Mac. Upload images, PDFs, Gerbers, data sheets, or other relevant files.

CAUTION
Do not submit Controlled Unclassified Information (CUI) through this form.

FORM SECURITY
Our forms are hosted with Amazon Web Services in the United States and use an industry-leading web application firewall. Data and uploads are encrypted at rest using AES-256 block-level storage encryption. We use a minimum of TLS 1.2 to encrypt network traffic between your web browser and our forms.

Removing BGA components that have underfill presents unique challenges due to the mechanical bond formed between the device and the circuit board. Specialized CNC milling systems are used to mill away the component and underfill without causing damage or degradation to the circuit board surface and adjacent components. Circuit Technology Center technicians follow proven methods and use advanced state-of-the-art tools to ensure clean, damage-free removal.

Key Highlights

Globally recognized authority in BGA rework
Trusted by aerospace, defense, and electronics leaders
Many advanced BGA rework systems
IPC-compliant processes for every project
Skilled engineers and technicians with high-reliability expertise
Comprehensive inspection, including high-resolution X-ray
Proven results for both small-scale and high-volume needs

Technical Specifications

Precision BGA removal, replacement, and salvage
High-resolution X-ray inspection and analysis

Compliance / References

9.5.1 BGA Component Removal, Machining Method
IPC 7711/7721 Rework, Modification, and Repair of Electronic Assemblies
IPC-A-610 Acceptability of Electronic Assemblies
IPC J-STD-006 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
IPC-JEDEC-J-STD-020 Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices
IPC-JEDEC-J-STD-033 Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
IPC-7095 Design and Assembly Process Implementation for BGAs
JESD22-B101-External Visual Standard
JESD625C.01 Requirements for Handling Electrostatic-Discharge-Sensitive (ESDS) Devices

Images

Figure 1. BGA components are not always parallel to the PCB surface. An adjustable fixture may be used to compensate for these irregularities.

Figure 2. Partial underfill along the component perimeter.

Figure 3. Complete underfill.

BGA Component Milling

Removing BGA components with underfill requires precision to overcome the mechanical bond without damaging the circuit board. Using specialized CNC milling systems, Circuit Technology Center ensures clean, controlled, damage-free removal.

Images

Related