Our BGA Reballing delivers fast, precise, IPC and JEDEC-compliant rework for lead-free to leaded conversions. With advanced equipment, expert staff, and rigorous inspection, we ensure top-tier quality, reliability, and repeatable results.
Trusted worldwide for precision BGA rework, we deliver IPC-compliant solutions for removal, reballing, pad repair, X-ray inspection, and circuit modification—backed by advanced systems and unmatched technical expertise.
Circuit Technology Center salvages hard-to-source components from PCBs using advanced rework systems, BGA reballing, and machine-ready tape and reel packaging, backed by over 40 years of expertise and precision.
Fast, flexible tape and reel services for SMT, through-hole, and custom components. EIA-481 compliant processing with inspection, ESD protection, MSL dry bake, and packaging per J-STD-033 and J-STD-020 standards.
Automated component tinning using six robotic hot solder dip (RHSD) systems for finish conversion and gold mitigation. Fully compliant with GEIA-STD-0006 and J-STD-001, with leaded and lead-free processing.
We use the advanced Dage Quadra 7 system for X-ray inspection to support BGA rework and fault analysis. High-resolution imaging, oblique views, and IPC-A-610 certified visual inspection ensure exceptional quality and defect detection.
