X-ray Inspection Services

Circuit Technology Center provides precision X-ray inspection services to ensure the quality and reliability of BGA rework and other critical assembly processes. Using our advanced Dage Quadra 7 system, every circuit board undergoing BGA rework is inspected with sub-micron accuracy to detect defects invisible to traditional methods. From solder joint shorts and voids to misalignment and incomplete reflow, our X-ray analysis delivers the clarity and confidence required for high-reliability applications. With real-time imaging, oblique angle viewing, and superior resolution, we provide unmatched diagnostic capability across fine-pitch and complex components.

• State-of-the-art Dage Quadra 7 X-ray inspection system
• Rigorous inspection of every BGA rework project
• Superior image clarity, resolution, and contrast
• Real-time imaging for immediate decision-making
• Oblique angle viewing of hidden solder joints
• Sub-micron feature recognition for fine-pitch devices
• Trusted by leading industries for fault detection and verification

• Detection of solder joint shorts, opens, and voids
• High-resolution real-time X-ray imaging
• Oblique angle viewing for complex assemblies
• Extensive grayscale definition for material variation analysis
• Sub-micron feature recognition for BGAs, LGAs, QFNs, and other fine-pitch devices
• Verification of solder integrity, alignment, and reflow performance
• Support for high-reliability aerospace, defense, and advanced electronics applications

• Sample X-Ray Report
• IPC-J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies
• IPC-A-610 Acceptability of Electronic Assemblies
• IPC-7095 Design and Assembly Process Implementation for BGAs
• IPC-JEDEC-J-STD-020 Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices
• IPC-JEDEC-J-STD-033 Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
• JESD625C.01 Requirements for Handling Electrostatic-Discharge-Sensitive (ESDS) Devices