Circuit Board Repair Services

Our BGA reballing service restores components with precision and full IPC/JEDEC compliance. Using advanced Air-Vac systems, custom fixtures, and rigorous inspection, we deliver high-reliability rework for critical electronic assemblies.

Trusted worldwide, we deliver expert BGA rework and repair services - from component removal to BGA pad repair and x-ray inspection - using IPC-approved methods and advanced equipment for unmatched precision and quality.

Standard jumper wires won't fit under BGAs - but our flat copper ribbon solution will. This IPC-recommended procedure, pioneered here, delivers precise, low-profile BGA site modifications trusted by engineers worldwide.

Circuit Technology Center delivers precision X-ray inspection for BGA rework using the Dage Quadra 7 system. Sub-micron imaging reveals hidden solder defects, misalignment, and reflow issues, ensuring reliable performance for aerospace, defense, and advanced electronics.

Our expert technicians repair damaged circuit boards using proven IPC-based methods to restore reliability. Every project is carefully evaluated, quoted in advance, and completed to the highest quality standards for commercial and military applications.

Circuit Technology Center restores damaged circuit traces and plated through holes using IPC-recommended PCB repair methods. Precision foil jumpers and eyelet installation replicate original manufacturing quality for high-reliability electronics.

Circuit Technology Center performs SMT and BGA pad repair using IPC-recommended, dry-film adhesive methods. Precision-fabricated pads restore structural and electrical integrity, ensuring reliable, standards-compliant PCB performance.

Circuit Technology Center delivers precision coating removal and solder mask repair using IPC-compliant methods. We modify, reapply, and update board surfaces, supporting high-reliability aerospace, defense, and advanced electronics programs.