SMT/BGA Pad Repair

At Circuit Technology Center, surface mount and BGA pad repairs are conducted daily using a proven, IPC-recommended procedure. Damaged pads are replaced with precision-fabricated, dry-film adhesive-backed pads that are thermally bonded to the PCB surface—eliminating the need for messy liquid epoxies and ensuring long-term reliability.

We maintain an extensive inventory of replacement pads in thousands of sizes and shapes to accommodate virtually any board design. This method delivers consistent, high-quality repairs that restore electrical and mechanical functionality in compliance with industry standards.

Standard Repair Procedure:

1. Pad Removal and Surface Prep
   The damaged pad and any contamination are carefully removed. The underlying circuit is cleaned, exposed, and tinned with solder. Any existing solder mask or coating over the connecting trace is stripped to prepare for bonding.
2. Pad Selection and Preparation
   A replacement pad is selected to match the original pad’s dimensions. Before trimming, the adhesive film is removed from the solder joint area on the back of the pad to ensure a clean, solderable surface.
3. Trimming and Placement
   The replacement pad is trimmed to include an extension of the circuit trace, allowing for a lap joint connection. The pad is aligned precisely on the board using high-temperature tape to maintain positioning.
4. Thermal Bonding
   Using a bonding iron with a tip matching the pad geometry, heat and pressure are applied to activate the dry-film adhesive. This thermal bonding secures the pad in place without the need for additional adhesives.
5. Soldering and Final Sealing
   For pads with circuit extensions, a lap solder joint is formed. The solder joint area is then encapsulated with high-strength, high-temperature epoxy to reinforce mechanical integrity and protect against environmental stress. 

This expertly controlled method ensures durable, functional pad restoration while maintaining the structural and electrical reliability demanded by today’s complex circuit designs.

• 4.7.1 Surface Mount Pad Repair, Epoxy Method
• 4.7.2 Surface Mount Pad Repair, Film Adhesive Method
• 4.7.3 Surface Mount, BGA Pad Repair, Film Adhesive Method
• 4.7.4 Surface Mount, BGA Pad with Integral Via Repair
• 4.7.5 Surface Mount, BGA Pad, Integral Via, Circuit Extension Method

• Case of the Missing SMT Pads
• Rework for Pad and Component Mismatch
• Correcting a Circuit Design Error: Two Proven Rework Strategies
• BGA Component Site Modification - Is it Possible?
• Solder Mask Rework at a BGA Site
• Solder Mask Touch-Up At BGA Sites
• Solution for BGA Footprint Mismatch

• 201-2100 Professional Repair Kit
• Circuit Frames