SMT/BGA Pad Repair

At Circuit Technology Center, surface-mount and BGA pad repairs are performed daily using a proven, IPC-recommended procedure. Damaged pads are replaced with precision-fabricated, dry-film adhesive-backed pads that are thermally bonded to the PCB surface - eliminating the need for messy liquid epoxies and ensuring long-term reliability.

We maintain an extensive inventory of replacement pads in thousands of sizes and shapes to accommodate virtually any board design. This expertly controlled repair process ensures a durable, functional pad restoration while maintaining the structural and electrical reliability demanded by today's complex circuit designs in compliance with industry standards.

Key Highlights

• Performing SMT pad repairs using IPC-recommended methods since 1986
• The most experienced and qualified technicians worldwide
• Surface-mount pad repairs are performed daily
• Ongoing technician training and skills reinforcement
• Many repair and rework materials have in-house fabrication control
• 10 calibrated systems for precision pad replacement
• Active role in industry standards development.

Technical Specifications

• Replacement materials include pads, lands, conductors, and other copper patterns
• Standard replacement materials are fabricated from 1 oz. copper foil
• Standard replacement materials are plated with lead-free or leaded solder
• Replacement materials have a dry-film thermoset adhesive backing
• Replacement materials are bonded using specially designed bonding systems

Compliance / References

• 4.2.2 Conductor Repair, Foil Jumper, Film Adhesive Method
• 4.4.2 Lifted Land Repair, Film Adhesive Method
• 4.5.2 Land Repair, Film Adhesive Method
• 4.6.2 Edge Contact Repair, Film Adhesive Method
• 4.7.2 Land Repair, Film Adhesive Method
• 4.7.3 Surface Mount, BGA Pad Repair, Film Adhesive Method
• IPC-7711/7721 Rework, Modification, and Repair of Electronic Assemblies
• IPC-A-610 Acceptability of Electronic Assemblies
• IPC-A-620 Requirements and Acceptance for Cable and Wire Harness Assemblies
• IPC-J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies
• IPC-JEDEC-J-STD-020 Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices
• IPC-JEDEC-J-STD-033 Handling, Packing, Shipping, and Use of Moisture, Reflow, and Process Sensitive Devices
• IPC-7095 Design and Assembly Process Implementation for BGAs
• JESD625C.01 Requirements for Handling Electrostatic-Discharge-Sensitive (ESDS) Devices

Images

Figure 1. At Circuit Technology Center, surface-mount and BGA pad repairs are performed daily using a proven, IPC-recommended procedure

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