Circuit Technology Center, in partnership with Keysight Technologies, delivers a complete turn-key solution for direct DIMM testing at BGA component sites. Using Keysight's W2630A Series DDR2 BGA probes, this setup enables high-fidelity signal capture and real-time performance analysis for advanced memory validation. Our expert technicians provide precise installation and adapter rework to ensure proper probe alignment and long-term reliability. Ideal for protocol validation, signal integrity characterization, and high-speed memory analysis, this solution supports both development and production environments with unmatched accuracy and efficiency.
Key Highlights
- Partnership with Keysight Technologies for DIMM BGA test solutions
- Expertise in high-density BGA component handling and rework
- Precision installation ensuring signal fidelity and probe alignment
- Turn-key service supporting development and production environments
- Experienced technicians trained in advanced memory test requirements
- Reliable, long-term performance through expert rework practices
Technical Specifications
- Direct DIMM testing at BGA component sites
- Keysight W2630A Series DDR2 BGA probes for high-fidelity capture
- Integration with Keysight logic analyzers and oscilloscopes
- Real-time protocol validation and signal integrity analysis
- Expert installation for accurate probe placement and mechanical stability
- Adapter rework services ensure compatibility and reliability
- Ideal for high-speed memory development and production testing
Compliance / References
- 8.0 Rework Procedures
- 9.0 BGA Component Rework and Reballing Procedures
- IPC-7711/7721 Rework, Modification, and Repair of Electronic Assemblies
- IPC-A-600 Acceptability of printed boards
- IPC-A-610 Acceptability of Electronic Assemblies
- IPC-A-620 Requirements and Acceptance for Cable and Wire Harness Assemblies
- IPC-J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies
- IPC-J-STD-004 Requirement for Soldering Fluxes
- IPC-J-STD-006 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed
- IPC-JEDEC-J-STD-020 Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices
- IPC-JEDEC-J-STD-033 Handling, Packing, Shipping, and Use of Moisture, Reflow, and Process Sensitive Devices
- JESD22-B101 External Visual Standard
- JESD625C.01 Requirements for Handling Electrostatic-Discharge-Sensitive (ESDS) Devices
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