BGA Site Modification

When circuit modifications are needed beneath a Ball Grid Array (BGA) component, traditional jumper wires are not practical due to space constraints. Circuit Technology Center provides a proven, precision solution using ultra-thin flat copper ribbon conductors. This low-profile method enables reliable modifications between the PCB surface and BGA underside without compromising electrical or mechanical performance. Performed by IPC-certified technicians with decades of experience, this process delivers consistent, high-reliability results. Our advanced BGA site modification services are trusted for critical applications where precision and performance are essential.

Key Highlights

• Proprietary process using ultra-thin flat copper ribbons
• Reliable solution for modifications under BGA components
• Maintains mechanical and electrical integrity in tight spaces
• IPC-certified technicians with decades of rework experience
• Proven, time-tested technique trusted in critical applications
• Scalable service for prototype and production requirements
• Consistent results backed by rigorous process control

Technical Specifications

• Low-profile copper ribbon conductors for BGA site modifications
• Designed for use between PCB surface and BGA underside
• Eliminates limitations of traditional jumper wire methods
• Provides reliable connectivity without compromising PCB integrity
• Performed by IPC-certified technicians using documented procedures
• Suitable for high-reliability aerospace, defense, and advanced electronics applications

Compliance / References

• 6.2.1 Jumper Wires, BGA Components, Circuit Track Method
• 6.2.2 Jumper Wires, BGA Components, Through-Board Method
• 9.0 BGA Component Rework and Reballing Procedures
• IPC 7711/7721 Rework, Modification, and Repair of Electronic Assemblies
• IPC-A-610 Acceptability of Electronic Assemblies
• IPC-A-620 Requirements and Acceptance for Cable and Wire Harness Assemblies
• IPC-J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies
• IPC-JEDEC-J-STD-020 Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices
• IPC-JEDEC-J-STD-033 Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
• IPC-7095 Design and Assembly Process Implementation for BGAs
• JESD625C.01 Requirements for Handling Electrostatic-Discharge-Sensitive (ESDS) Devices

Images

Figure 1. This illustration shows one method for modifying a BGA pad connection.

Related

BGA Component Site Modification - Is it Possible?

BGA site mods use precision ribbon circuits through sleeved holes to avoid bulky jumpers while maintaining robust conductors under dense components.

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