Electronic Component Reclaim Services

With six fully programmable robotic hot solder dip systems, Circuit Technology Center provides precision component tinning for tin whisker mitigation, gold removal, and solderability enhancement to GEIA-STD-0006 and J-STD-001 standards.

Our BGA reballing service restores components with precision and full IPC/JEDEC compliance. Using advanced Air-Vac systems, custom fixtures, and rigorous inspection, we deliver high-reliability rework for critical electronic assemblies.

Trusted worldwide, we deliver expert BGA rework and repair services - from component removal to BGA pad repair and x-ray inspection - using IPC-approved methods and advanced equipment for unmatched precision and quality.

Circuit Technology Center delivers precision component salvage and reclamation for obsolete or hard-to-source parts. Using advanced hot-gas rework and robotic solder dip systems, we restore components to standards-compliant condition with full traceability and quality control.

Circuit Technology Center delivers precision X-ray inspection for BGA rework using the Dage Quadra 7 system. Sub-micron imaging reveals hidden solder defects, misalignment, and reflow issues, ensuring reliable performance for aerospace, defense, and advanced electronics.

Circuit Technology Center offers fast, EIA-481-compliant tape and reel services for SMT, through-hole, and custom components. Includes MSL dry bake and moisture barrier packaging per J-STD-033 and J-STD-020 standards.