SMT and Through Hole Component Rework

Removal and replacement of surface mount and through hole components is one of the most common rework processes performed on assembled circuit boards. Although commonplace and sometimes routine, today’s component packages and board features present an array of difficult component rework challenges.

We have over 100 pieces of equipment from Pace, Metcal and OK Industries, Air-Vac, and Electrovert to meet most any surface mount, BGA, and through hole component rework need. Our trained and qualified technicians are ready to tackle your toughest rework projects.

Refer to the following procedures for detailed information.

• Removal and Replacement, Small Through Hole Components
• Removal and Replacement, SIP/DIP Through Hole Components
• Removal and Replacement, Large Through Hole Components
• Removal and Replacement, Surface Mount Chip Components
• Removal and Replacement, Small Surface Mount Components
• Removal and Replacement, Large Surface Mount Components

For prices on component rework go to: Service Charges.

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Surface Mount Component Rework

Controlled hot air rework.

We use a mix of convection and conduction techniques for surface mount component removal. Many factors are considered, but normally conduction methods are used to remove smaller components.

Convection techniques are commonly used to remove larger, more sensitive components. Point to point soldering methods are normally used to replace surface mount components.

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Through Hole Component Rework

Solder fountain systems for high pin count through hole rework.

We use vacuum desoldering systems for small through hole removal projects. We call upon our Electrovert Solder Fountain Systems for demanding multi-lead rework projects. These systems take great skill and experience to operate, but for high pin count through hole component rework, these workhorses can’t be beat for reliability and efficiency.