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SMT and Through Hole Component Rework
Removal and replacement of surface mount and through hole components is one of the most common rework processes performed on assembled circuit boards. Although commonplace and sometimes routine, today's component packages and board features present an array of difficult component rework challenges. We have over 100 pieces of equipment from Pace, Metcal and OK Industries, Air-Vac, and Electrovert to meet most any surface mount, BGA, and through hole component rework need. Our trained and qualified technicians are ready to tackle your toughest rework projects. Refer to the following procedures for detailed information.
For prices on component rework go to: Service Charges. Surface Mount Component Rework
Convection techniques are commonly used to remove larger, more sensitive components. Point to point soldering methods are normally used to replace surface mount components. Through Hole Component Rework
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Customer Comments
"The technicians at Circuit Technology Center have proven once again that they can handle anything that we throw at them. Thanks again for getting us out of a jam." A.C. Derby, England Send us your comments |
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