BGA Component Site Modification
When your design requires a change or modification at a BGA site, using a standard jumper wire is normally not an option. Jumper wires are simply to large to fit under a BGA component. The ingenious modification procedure employed at Circuit Technology Center uses flat copper ribbon thin enough to fit safely under the BGA component.
For more on this IPC recommended procedure see Jumper Wires, BGA Components.
Preview the slides below to learn more.
Step 1: We cut the connection to the via using a Precision Drill System.
Step 2: We remove the BGA pad and mill a shallow channel into the solder mask surface.
Step 3: We bond a new BGA pad in place.
Step 4: We solder a copper circuit track to the tail extending from the new BGA pad.
Step 5: We Solder a wire to the Circuit Track and overcoat it with epoxy.
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Circuit Frames for surface mount pad, BGA pad and conductor repair.
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Use the form on our page, or give us a call at 978-374-5000.
Including BGA component reball service to replace lead-free solder balls with leaded solder balls for high-rel applications.
Including BGA rework, BGA component x-ray services, repair of damaged BGA pads and repair of BGA solder mask damage.
This ingenious modification procedure uses flat copper ribbon that fits under the BGA component to provide an electrical path for modification.
Including repair damaged circuit base board laminate, delamination, warp, hole damage, burns, and solder mask damage.
Including repair damage to conductors, circuitry and plated holes, plus repair of damaged plated holes with inner layer connections.
Including removal or replacement of conformal coatings and solder mask, and repair of circuit board legend and markings.
Including removal and replacement of surface mount components, through hole components, connectors and many other component types.
Includes removal and salvage of BGA components, surface mount components, connectors and many other component types.
Including ECO, engineering changes, upgrades, modifications, jumper wires, circuit cuts, and other modification procedures.
Including repair and replating of solder contaminated gold contacts, scratched gold contacts and worn gold contacts.
Including BGA component and circuit board x-ray inspection services using high-end Dage inspection systems.
This page explains the process for installing Keysight Technologies DDR2 DRAM BGA Probes onto circuit boards.
Form to send circuit boards to us for repair and rework.
Use this form to request a quote for circuit board repair, rework, modification services.
Including repair of damaged, lifted or missing surface mount pads, BGA pads, and BGA pads with with integral via connections.
Service terms, prices, and delivery information covering our circuit board repair and rework services.
Customer Comments "I received the modified boards today (earlier than I expected) they tested fine. Nice job. I am amazed that you can do this type of work."
D.K. Plymouth, MI USA
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Circuit Technology Center has been an IPC member since 1986
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