Circuit Technology Center offers advanced Robotic Hot Solder Dip (RHSD) tinning services specifically tailored for PLCC (Plastic Leaded Chip Carrier) components. Our process is designed to modify the existing metallic finish on component leads - most commonly converting a lead-free finish to a leaded tin-lead (Sn63/Pb37) finish for tin whisker mitigation. Additionally, we process PLCCs requiring gold plating removal as part of gold mitigation protocols.
We use fully programmable RHSD machines that deliver precise control over all critical process parameters, including dip depth, dwell time, and solder temperature. These systems ensure repeatable and highly accurate results for each component. Every tinning operation is executed in strict accordance with GEIA-0006 standards, ensuring the complete removal of the existing finish and the consistent application of fresh tin-lead solder.
For PLCCs requiring gold mitigation, we follow the procedures outlined in J-STD-001. Our process effectively removes gold plating to prevent potential reliability issues caused by gold embrittlement in solder joints.
Following the tinning process, components undergo batch wash cleaning to eliminate flux residues and contaminants. We also offer a complete range of post-process services, including MSL (Moisture Sensitivity Level) bake and dry packing, tape-and-reel packaging, and both pre- and post-process electrical and visual inspections upon request.
Our RHSD tinning services for PLCC devices ensure reliable solderability, enhanced performance, and compliance with industry standards, making them an essential solution for high-reliability applications across aerospace, defense, and advanced electronics sectors.
Additional Component Modification Services and More Information
- BGA Component Reballing Services
- LGA Component Tinning
- QFP Component Tinning
- SOIC Component Tinning
- SOT-23 Component Tinning
- Through-Hole Connector Tinning
- Discreet SMT Device Tinning
In-house post-processing testing capabilities include:
- Ionic cleanliness (ROSE) testing per IPC-TM-650-2.3.25
- XRF for alloy composition and finish thickness per JESD 213
- Solderability testing per J-STD-002
- Visual inspection
Other available testing services include:
- SAM (scanning acoustic microscopy) testing per J-STD-035
- Destructive physical analysis (DPA) per MIL-STD-1580
- Hermeticity testing (fine and gross leak) per MIL-STD-883
- Temperature, humidity, and bias testing
- Parametric testing
Component Marking and Packaging Services include:
