Our robotic hot solder dip (RHSD) services are designed to precisely and reliably modify the metallic finish on the leads of quad flat package (QFP) components. Most commonly, this process is used to convert lead-free terminations to leaded (Sn63/Pb37) finishes, thereby mitigating the risk of tin whiskers. The same process is also employed for gold plating removal and gold mitigation applications. We use fully programmable RHSD systems that tightly control dip depth, dwell time, and solder temperature, ensuring full compliance with GEIA-0006 requirements. This high-precision, automated process guarantees complete removal of the original finish and uniform reapplication of a tin-lead solder coating. Gold removal and mitigation operations are performed in accordance with J-STD-001 standards to ensure optimal long-term reliability. To support a full-service offering, we provide batch wash systems for thorough post-process cleaning, along with tape-and-reel packaging, MSL baking, and both pre- and post-process inspection and testing as needed.
In-house post-processing testing capabilities include:
Other available testing services include:
Component Marking and Packaging Services include:
|
Related Guides |
Tinning Services, QFP Components
Circuit Technology Center provides precise RHSD tinning for QFP devices, converting finishes for tin whisker or gold mitigation per GEIA-0006 and J-STD-001. Full post-process cleaning, testing, and MSL-compliant packaging included.
