Our robotic hot solder dip (RHSD) services are designed to precisely and reliably modify the metallic finish on the leads of quad flat package (QFP) components. Most commonly, this process is used to convert lead-free terminations to leaded (Sn63/Pb37) finishes, thereby mitigating the risk of tin whiskers. The same process is also employed for gold plating removal and gold mitigation applications.
We use fully programmable RHSD systems that tightly control dip depth, dwell time, and solder temperature, ensuring full compliance with GEIA-0006 requirements. This high-precision, automated process guarantees complete removal of the original finish and uniform reapplication of a tin-lead solder coating.
Gold removal and mitigation operations are performed following J-STD-001 standards to ensure optimal long-term reliability.
To support a full-service offering, we provide batch wash systems for thorough post-process cleaning, along with tape-and-reel packaging, MSL baking, and both pre- and post-process inspection and testing as needed.
- BGA Component Reballing Services
- LGA Component Tinning
- PLCC Component Tinning
- SOIC Component Tinning
- SOT-23 Component Tinning
- Through Hole Connector Tinning
- Discreet SMT Device Tinning
In-house post-processing testing capabilities include:
- Ionic cleanliness (ROSE) testing per IPC-TM-650-2.3.25
- XRF for alloy composition and finish thickness per JESD 213
- Solderability testing per J-STD-002
- Visual inspection
Other available testing services include:
- SAM (scanning acoustic microscopy) testing per J-STD-035
- Destructive physical analysis (DPA) per MIL-STD-1580
- Hermeticity testing (fine and gross leak) per MIL-STD-883
- Temperature, humidity, and bias testing
- Parametric testing
Component Marking and Packaging Services include:
- Tape and Reel service per EIA 481
- Component MSL dry bake per J-Std-033
- Component MSL packaging per J-Std-020
