Tinning Services, QFP Components

Our robotic hot solder dip (RHSD) services are designed to precisely and reliably modify the metallic finish on the leads of quad flat package (QFP) components. Most commonly, this process is used to convert lead-free terminations to leaded (Sn63/Pb37) finishes, thereby mitigating the risk of tin whiskers. The same process is also employed for gold plating removal and gold mitigation applications.

We use fully programmable RHSD systems that tightly control dip depth, dwell time, and solder temperature, ensuring full compliance with GEIA-0006 requirements. This high-precision, automated process guarantees complete removal of the original finish and uniform reapplication of a tin-lead solder coating.

Gold removal and mitigation operations are performed in accordance with J-STD-001 standards to ensure optimal long-term reliability.

To support a full-service offering, we provide batch wash systems for thorough post-process cleaning, along with tape-and-reel packaging, MSL baking, and both pre- and post-process inspection and testing as needed.

In-house post-processing testing capabilities include:

Ionic cleanliness (ROSE) testing per IPC-TM-650-2.3.25
XRF for alloy composition and finish thickness per JESD 213
Solderability testing per J-STD-002
Visual inspection

Other available testing services include:

SAM (scanning acoustic microscopy) testing per J-STD-035
Destructive physical analysis (DPA) per MIL-STD-1580
Hermeticity testing (fine and gross leak) per MIL-STD-883
Temperature, humidity, and bias testing
Parametric testing

Component Marking and Packaging Services include:

Tape and Reel service per EIA 481
Component MSL dry bake per J-Std-033
Component MSL packaging per J-Std-020

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