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QFP Component Tinning

Our robotic hot solder dip (RHSD) component tinning services are used to change the metallic finish of QFP devices, most commonly to convert the metallic finish from lead free to leaded (Sn63/Pb37) for tin mitigation applications. Our RHSD service is also used to process QFP’s that require gold plating removal or for gold mitigation applications.

We use fully programmable robotic hot solder dip (RHSD) machines to precisely control dip depth, dwell times and temperatures for processing of components in full compliance with GEIA-0006 standards. This highly automated, tightly controlled process ensures that 100% of the tin finish is removed and replaced with tin-lead (Sn63/Pb37).

Gold removal/mitigation is completed in accordance with J-Std-001 specifications.

We use batch wash systems for post process cleaning, provide tape and reel services, component MSL bake and packaging and pre/post process testing as needed.

Additional Component Modification Services and More Information In house post processing testing capabilities include:
  • Ionic cleanliness (ROSE) testing per IPC-TM-650-2.3.25
  • XRF for alloy composition and finish thickness per JESD 213
  • Solderability testing per J-STD-002
  • Visual inspection
Other available testing services include:
  • SAM (scanning acoustic microscopy) testing per J-STD-035
  • Destructive physical analysis (DPA) per MIL-STD-1580
  • Hermeticity testing (fine and gross leak) per MIL-STD-883
  • Temperature, humidity and bias testing
  • Parametric testing
Component Marking and Packaging Services include:
  • Tape and Reel service per EIA 481
  • Component MSL dry bake per J-Std-033
  • Component MSL packaging per J-Std-020


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