Our robotic hot solder dip (RHSD) component tinning services change the metallic finish of QFP devices, most commonly converting the metallic finish from lead-free to leaded (Sn63/Pb37) for tin mitigation applications. Our RHSD service is also used to process QFPs that require gold plating removal or for gold mitigation applications.
We use fully programmable robotic hot solder dip (RHSD) machines to precisely control dip depth, dwell times, and temperatures for processing components in full compliance with GEIA-0006 standards. This highly automated, tightly controlled process ensures that 100% of the tin finish is removed and replaced with tin-lead (Sn63/Pb37).
Gold removal/mitigation is completed in accordance with J-Std-001 specifications.
QFP device component tinning by automated robotic hot solder dip system for tin mitigation.
We use batch wash systems for post-process cleaning, provide tape and reel services, component MSL bake and packaging, and pre/post-process testing as needed.
Additional Component Modification Services and More Information