Circuit Technology Center offers precision robotic hot solder dip (RHSD) services for SOIC (Small Outline Integrated Circuit) devices, modifying the termination finish to enhance reliability in critical applications. Our RHSD process most commonly converts lead-free terminations to tin-lead (Sn63/Pb37) to mitigate the risk of tin whiskers. Additionally, we perform gold plating removal for gold mitigation applications.
Our fully programmable RHSD systems ensure precise control over dip depth, dwell time, and temperature, maintaining full compliance with GEIA-0006 standards. This highly automated process guarantees that the original finish is completely removed and replaced with tin-lead, ensuring uniformity and consistency across all processed components.
Gold removal and mitigation procedures are carried out following J-Std-001 specifications.
Post-processing includes batch wash cleaning, tape and reel packaging, MSL baking, and pre- and post-process testing as required. This comprehensive, standards-based service ensures high reliability and performance in mission-critical applications.
Additional Component Modification Services and More Information
- BGA Component Reballing Services
- LGA Component Tinning
- QFP Component Tinning
- PLCC Component Tinning
- SOT-23 Component Tinning
- Through Hole Connector Tinning
- Discreet SMT Device Tinning
In-house post-processing testing capabilities include:
- Ionic cleanliness (ROSE) testing per IPC-TM-650-2.3.25
- XRF for alloy composition and finish thickness per JESD 213
- Solderability testing per J-STD-002
- Visual inspection
Other available testing services include:
- SAM (scanning acoustic microscopy) testing per J-STD-035
- Destructive physical analysis (DPA) per MIL-STD-1580
- Hermeticity testing (fine and gross leak) per MIL-STD-883
- Temperature, humidity, and bias testing
- Parametric testing
Component Marking and Packaging Services include:
