Circuit Technology Center offers precision robotic hot solder dip (RHSD) services for SOIC (Small Outline Integrated Circuit) devices, modifying the termination finish to enhance reliability in critical applications. Our RHSD process most commonly converts lead-free terminations to tin-lead (Sn63/Pb37) to mitigate the risk of tin whiskers. Additionally, we perform gold plating removal for gold mitigation applications. Our fully programmable RHSD systems ensure precise control over dip depth, dwell time, and temperature, maintaining full compliance with GEIA-0006 standards. This highly automated process guarantees that the original finish is completely removed and replaced with tin-lead, ensuring uniformity and consistency across all processed components. Gold removal and mitigation procedures are carried out following J-Std-001 specifications. Post-processing includes batch wash cleaning, tape and reel packaging, MSL baking, and pre- and post-process testing as required. This comprehensive, standards-based service ensures high reliability and performance in mission-critical applications. Additional Component Modification Services and More Information
In-house post-processing testing capabilities include:
Other available testing services include:
Component Marking and Packaging Services include: |
Related Guides |
Tinning Services, SOIC Components
Circuit Technology Center offers RHSD tinning for SOIC devices, converting finishes for tin whisker and gold mitigation per GEIA-0006 and J-STD-001. Services include cleaning, testing, and MSL-compliant packaging.
