Circuit Technology Center offers advanced robotic hot solder dip (RHSD) tinning services specifically engineered for land grid array (LGA) devices. This process is commonly used to convert the pad finish from lead-free to tin-lead (Sn63/Pb37) for tin whisker mitigation. Our RHSD service is also employed for gold plating removal when gold mitigation is required.
Using fully programmable RHSD equipment, we maintain precise control over dip depth, dwell time, and temperature. This high-precision, automated process ensures the complete removal of the existing finish and full replacement with tin-lead solder, strictly in compliance with GEIA-0006 standards. For applications requiring gold mitigation, all work is performed following J-STD-001 specifications.
For customers transitioning LGA devices to BGA form factors, we offer follow-on ball attach services after the RHSD process is completed.
Supporting services include batch post-process cleaning, tape-and-reel packaging, MSL component baking and dry packing following J-STD-020/J-STD-033, and both pre- and post-process electrical or visual testing as required.
Additional Component Modification Services and More Information
- BGA Component Reballing Services
- QFP Component Tinning
- PLCC Component Tinning
- SOIC Component Tinning
- SOT-23 Component Tinning
- Through-Hole Connector Tinning
- Discreet SMT Device Tinning
In-house post-processing testing capabilities include:
- Ionic cleanliness (ROSE) testing per IPC-TM-650-2.3.25
- XRF for alloy composition and finish thickness per JESD 213
- Solderability testing per J-STD-002
- Visual inspection
Other available testing services include:
- SAM (scanning acoustic microscopy) testing per J-STD-035
- Destructive physical analysis (DPA) per MIL-STD-1580
- Hermeticity testing (fine and gross leak) per MIL-STD-883
- Temperature, humidity, and bias testing
- Parametric testing
Component Marking and Packaging Services include:
- Tape and Reel service per EIA 481
- Component MSL dry bake per J-Std-033
- Component MSL packaging per J-Std-020
