Tinning Services, LGA Components

Circuit Technology Center offers advanced robotic hot solder dip (RHSD) tinning services specifically engineered for land grid array (LGA) devices. This process is commonly used to convert the pad finish from lead-free to tin-lead (Sn63/Pb37) for tin whisker mitigation. Our RHSD service is also employed for gold plating removal when gold mitigation is required.

Using fully programmable RHSD equipment, we maintain precise control over dip depth, dwell time, and temperature. This high-precision, automated process ensures the complete removal of the existing finish and full replacement with tin-lead solder, strictly in compliance with GEIA-0006 standards. For applications requiring gold mitigation, all work is performed following J-STD-001 specifications.

For customers transitioning LGA devices to BGA form factors, we offer follow-on ball attach services after the RHSD process is completed.

Supporting services include batch post-process cleaning, tape-and-reel packaging, MSL component baking and dry packing in accordance with J-STD-020/J-STD-033, and both pre- and post-process electrical or visual testing as required.

Additional Component Modification Services and More Information

In house post-processing testing capabilities include:

Ionic cleanliness (ROSE) testing per IPC-TM-650-2.3.25
XRF for alloy composition and finish thickness per JESD 213
Solderability testing per J-STD-002
Visual inspection

Other available testing services include:

SAM (scanning acoustic microscopy) testing per J-STD-035
Destructive physical analysis (DPA) per MIL-STD-1580
Hermeticity testing (fine and gross leak) per MIL-STD-883
Temperature, humidity and bias testing
Parametric testing

Component Marking and Packaging Services include:

Tape and Reel service per EIA 481
Component MSL dry bake per J-Std-033
Component MSL packaging per J-Std-020

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