Circuit Technology Center offers advanced robotic hot solder dip (RHSD) tinning services specifically engineered for land grid array (LGA) devices. This process is commonly used to convert the pad finish from lead-free to tin-lead (Sn63/Pb37) for tin whisker mitigation. Our RHSD service is also employed for gold plating removal when gold mitigation is required. Using fully programmable RHSD equipment, we maintain precise control over dip depth, dwell time, and temperature. This high-precision, automated process ensures the complete removal of the existing finish and full replacement with tin-lead solder, strictly in compliance with GEIA-0006 standards. For applications requiring gold mitigation, all work is performed following J-STD-001 specifications. For customers transitioning LGA devices to BGA form factors, we offer follow-on ball attach services after the RHSD process is completed. Supporting services include batch post-process cleaning, tape-and-reel packaging, MSL component baking and dry packing in accordance with J-STD-020/J-STD-033, and both pre- and post-process electrical or visual testing as required. Additional Component Modification Services and More Information
In house post-processing testing capabilities include:
Other available testing services include:
Component Marking and Packaging Services include:
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Tinning Services, LGA Components
Circuit Technology Center offers precision RHSD tinning for LGA devices, converting finishes for tin or gold mitigation per GEIA-0006 and J-STD-001. Post-tinning services include BGA ball attach, testing, and full MSL-compliant packaging.
