Our robotic hot solder dip (RHSD) component tinning services change the metallic finish on the pads of LGA devices, most commonly converting the metallic finish from lead-free to leaded (Sn63/Pb37) for tin mitigation applications. Our RHSD service can also be used to process LGAs that require gold plating removal for gold mitigation applications. If required, after the pads are prepared through the RHSD process, ball attach services can then be completed to convert LGA devices into BGA devices.
We use fully programmable robotic hot solder dip (RHSD) machines to precisely control dip depth, dwell times, and temperatures for processing components in full compliance with GEIA-0006 standards. This highly automated, tightly controlled process ensures that 100% of the tin finish is removed and replaced with tin-lead (Sn63/Pb37).
Gold removal/mitigation is completed in accordance with J-Std-001 specifications.
LGA device after RHSD gold mitigation and solder balls attached.
We use batch wash systems for post-process cleaning, provide tape and reel services, component MSL bake and packaging, and pre/post-process testing as needed.
Additional Component Modification Services and More Information
Use the form below to contact us, to request a quote, or to place an order. You may also call us during normal business hours at 978-374-5000. * Indicated required field.
