Our robotic hot solder dip (RHSD) services are designed to modify the metallic finish on the leads of SOT-23 components, most commonly converting from a lead-free finish to a tin-lead (Sn63/Pb37) finish for tin whisker mitigation. In addition, RHSD is used for gold plating removal to meet gold mitigation requirements.
We operate fully programmable RHSD equipment that provides precise control over dip depth, dwell time, and solder temperature. This high-precision, tightly regulated process ensures the complete removal and replacement of the original finish, adhering to GEIA-0006 standards.
For gold mitigation applications, the process is performed in full compliance with J-STD-001 specifications to ensure optimal reliability and solderability.
Post-process cleaning is completed using batch wash systems. We also offer tape-and-reel packaging, MSL baking and dry-packing, and both pre- and post-tinning inspection and testing, as needed, to meet your production and quality requirements.
- BGA Component Reballing Services
- LGA Component Tinning
- QFP Component Tinning
- PLCC Component Tinning
- SOIC Component Tinning
- Through Hole Connector Tinning
- Discreet SMT Device Tinning
In-house post-processing testing capabilities include:
- Ionic cleanliness (ROSE) testing per IPC-TM-650-2.3.25
- XRF for alloy composition and finish thickness per JESD 213
- Solderability testing per J-STD-002
- Visual inspection
Other available testing services include:
- SAM (scanning acoustic microscopy) testing per J-STD-035
- Destructive physical analysis (DPA) per MIL-STD-1580
- Hermeticity testing (fine and gross leak) per MIL-STD-883
- Temperature, humidity, and bias testing
- Parametric testing
Component Marking and Packaging Services include:
- Tape and Reel service per EIA 481
- Component MSL dry bake per J-Std-033
- Component MSL packaging per J-Std-020
