Circuit Technology Center offers precision robotic hot solder dip (RHSD) services to refinish the metallic leads of through-hole connectors. This process is most often used for tin whisker mitigation, where lead-free finishes are converted to leaded (Sn63/Pb37). RHSD is also an effective solution for removing gold plating from through-hole and radial connector terminations.
Our RHSD systems are fully programmable to deliver tightly controlled processing parameters - including dip depth, dwell time, and temperature - ensuring consistent, high-quality results. All operations are performed in full compliance with GEIA-0006 standards to guarantee complete removal and replacement of the original finish.
Gold mitigation procedures are executed following J-STD-001 specifications. Post-process cleaning is conducted using batch wash systems.
We also provide related services such as tape and reel packaging, MSL dry bake and moisture barrier packaging, and pre- and post-process testing as required.
- BGA Component Reballing Services
- LGA Component Tinning
- QFP Component Tinning
- PLCC Component Tinning
- SOIC Component Tinning
- SOT-23 Component Tinning
- Discreet SMT Device Tinning
In-house post-processing testing capabilities include:
- Ionic cleanliness (ROSE) testing per IPC-TM-650-2.3.25
- XRF for alloy composition and finish thickness per JESD 213
- Solderability testing per J-STD-002
- Visual inspection
Other available testing services include:
- SAM (scanning acoustic microscopy) testing per J-STD-035
- Destructive physical analysis (DPA) per MIL-STD-1580
- Hermeticity testing (fine and gross leak) per MIL-STD-883
- Temperature, humidity, and bias testing
- Parametric testing
Component Marking and Packaging Services include:
