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Outline
The guides in this section detail multiple base board related repairs. It includes delamination/blister correction using injection, bow and twist straightening, and various surface material repairs using epoxy for minor damage repairs and transplants for major repairs. These procedures target structural integrity, dimensional accuracy, and functional reliability, whether correcting warpage, restoring hole integrity, repairing board edges, or replacing damaged material areas. Each method specifies when to use minor versus major repair approaches to ensure proper restoration and long-term durability. |
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Procedure covers delamination and blister repair on circuit board assemblies.
This procedure covering bow and twist repair on circuit board assemblies.
This procedure covers minor repair of non-plated holes on circuit board assemblies.
This procedures covers major repair of damage to non-plated holes on circuit board assemblies.
This procedure covers minor repair of key slots on circuit board assemblies.
This procedure covers major repair of key slots on circuit board assemblies.
Procedure covers minor repair of damaged base board around edges on circuit board assemblies.
This procedure covers major repair of damaged base board within the inner area on circuit board assemblies.
This procedure covers major repair of damaged base board around edges on circuit board assemblies.
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3.0 Base Board Repair Procedures
Procedures covering bow and twist repair, repair of non-plated holes and slots and base board repair.
Minimum Skill Level: N/A
Conformance Level: N/A
REQUEST FOR QUOTE GUIDES INDEX
