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Outline
The guides in this section provide comprehensive procedures for BGA component rework and reballing on circuit board assemblies. It covers process flow and inspection guidelines for both reworked and reballed components, as well as profile development using standard or Smart Track methods. Detailed rework techniques address component removal, solder ball removal (via braid or robotic methods), and reattachment using mini-oven or reflow oven processes. Special procedures are included for machining removal of BGAs installed with non-reworkable underfill. Each method emphasizes proper thermal profiling, inspection standards, and handling practices to maintain solder joint integrity, component functionality, and overall assembly reliability. |
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Procedure reviews the component review process prior to reworking BGA components on circuit board assemblies.
Procedure covers guidelines for inspection of reworked BGA components on circuit board assemblies.
Procedure covers guidelines for inspection of reballed BGA components.
Procedure covers process steps to develop a BGA rework profile on circuit board assemblies.
Procedure covers process steps to develop a BGA rework profile on circuit board assemblies.
Procedure covers methods for BGA component rework on circuit board assemblies.
Procedure covers BGA component reballing using solder braid ball removal and mini-oven attachment.
Procedure covers BGA component reballing using solder braid ball removal and reflow oven attachment.
Procedure covers BGA component reballing using robotic ball removal and mini-oven attachment.
Procedure covers BGA component reballing using robotic ball removal and reflow oven attachment.
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9.0 BGA Component Rework and Reballing Procedures
List of procedures covering BGA component rework and reballing on circuit board assemblies.
Minimum Skill Level: N/A
Conformance Level: N/A
REQUEST FOR QUOTE GUIDES INDEX
