9.0 BGA Component Rework Procedures

9.0 BGA Component Rework Procedures

Printed Board Type: N/A
Skill Level: N/A
Conformance Level: N/A
Revision: N/A
Revision Date: N/A

	9.1.1 BGA Rework Process Flow Covers general process flow for BGA component rework. 9.1.2 BGA Rework Inspection Covers general inspection methods for BGA components.
	9.2.1 BGA Rework Profile Development, Standard Development of rework profile using standard method. 9.2.2 BGA Rework Profile Development, Smart Track Development of rework profile using Smart Track Method.
	9.3.1 BGA Rework, Eutectic Solder Ball Hot gas method for eutectic solder ball BGA rework.
	9.4.1 BGA Reballing, Fixture Method Method for reballing BGA components using replacement balls and special fixture.

This procedure is for reference only. Refer to the Procedure References listed above, or contact Circuit Technology Center for appropriate industry approved references.

Related Information

BGA Rework Services
BGA Pad Repair Kits
BGA Pad Repair and Modification Guides
BGA Component Rework Guides

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