7.1.1 Soldering Basics Procedure covers the basic concepts for quality soldering.

7.1.2 Preparation For Soldering And Component Removal Procedure covers preparation steps before soldering and rework.

7.1.3 Solder Joint Acceptance Criteria Document includes figures and tables for solder joint acceptability criteria based on IPC standards.

7.2.1 Soldering Through Hole Components, Point To Point Method Procedure covers point to point soldering for through-hole components.

7.2.2 Soldering Through Hole Components, Solder Fountain Method Procedure covers through hole soldering using a solder fountain system.

7.3.1 Soldering Surface Mount Chip Components, Point To Point Method Procedure covers point to point soldering of chip components.

7.3.2 Soldering Surface Mount Chip Components, Hot Gas Method Procedure covers hot gas soldering of chip components.

7.4.1 Soldering Surface Mount J Lead Components Point To Point Method Procedure covers point to point soldering for "J" lead surface mount components.

7.4.2 Soldering Surface Mount J Lead Components Continuous Flow Method Procedure covers continuous flow soldering for "J" lead surface mount components.

7.4.3 Soldering Surface Mount J Lead Components Hot Gas Method Procedure covers soldering for "J" lead surface mount components using hot gas.

7.5.1 Soldering Surface Mount Gull Wing Components, Point To Point Method Procedure covers point to point soldering for Gull Wing surface mount components.

7.5.2 Soldering Surface Mount Gull Wing Components, Continuous Flow Method Procedure covers continuous flow soldering for Gull Wing surface mount components.

7.5.3 Soldering Surface Mount Gull Wing Components Hot Gas Method Procedure covers soldering for Gull Wing surface mount components using hot gas.

This procedure is for reference only. Refer to the Procedure References listed above, or contact Circuit Technology Center for appropriate industry approved references.

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