7.0 Soldering Procedures

The guides in this section provide comprehensive soldering procedures for circuit board assemblies, covering foundational skills, preparation, and solder joint acceptance criteria with detailed tables and illustrations. Methods include point-to-point, solder fountain, continuous flow, and hot gas techniques for through-hole, chip, J-lead, and gull wing components. Each procedure specifies the tools, materials, and process controls necessary to achieve high-quality, reliable solder joints while meeting industry standards. The content supports both production and rework environments, ensuring proper thermal management, mechanical integrity, and electrical performance. These guidelines help technicians select the optimal soldering approach based on component type, assembly configuration, and repair or manufacturing requirements.