4.0 Conductor Procedures

4.0 Conductor Procedures

Printed Board Type: N/A
Skill Level: N/A
Conformance Level: N/A
Revision:
Revision Date:

	4.1.1 Lifted Conductor Repair, Epoxy Seal Rebond a lifted conductor with liquid epoxy. 4.1.2 Lifted Conductor Repair, Film Adhesive Rebond a lifted conductor with film adhesive.
	4.2.1 Conductor Repair, Foil Jumper, Epoxy Uses foil jumper bonded with liquid epoxy. 4.2.2 Conductor Repair, Foil Jumper, Film Adhesive Uses foil jumper bonded with film adhesive.
	4.2.3 Conductor Repair, Welding Replace damaged conductor by welding. 4.2.4 Conductor Repair, Surface Wire Replace damaged conductor with jumper wire.
	4.2.5 Conductor Repair, Through Board Wire Replace damaged conductor with jumper wire . 4.2.6 Conductor Repair, Inner Layer Advanced inner layer conductor repair.
	4.2.7 Conductor Repair, Surface Plane, Film Adhesive Used to repair damaged surface planes.
	4.3.1 Circuit Cut, Surface Circuit Cut a surface circuit or conductor. 4.3.2 Circuit Cut, Inner Layer Cut an inner layer circuit or conductor.
	4.3.3 Deleting Plated Hole Connection, Drill Through Sever internal connection by drilling out hole. 4.3.4 Deleting Plated Hole Connection, Spoke Cut Sever internal connection by cutting internal spokes.
	4.4.1 Lifted Land Repair, Epoxy Seal Method Rebond a lifted land with liquid epoxy. 4.4.2 Lifted Land Repair, Film Adhesive Method Rebond a lifted land with film adhesive.
	4.5.1 Land Repair, Epoxy Method Replace damaged land with liquid epoxy. 4.5.2 Land Repair, Film Adhesive Method Replace damaged land with film adhesive.
	4.6.1 Edge Contact Repair, Epoxy Method Replace damaged edge contacts with liquid epoxy. 4.6.2 Edge Contact Repair, Film Adhesive Method Replace damaged edge contacts with film adhesive.
	4.6.3 Edge Contact Repair, Plating Method Replate damaged or solder contaminated edge contacts.
	4.7.1 Surface Mount Pad Repair, Epoxy Method Replace damaged SM pads with liquid epoxy. 4.7.2 Surface Mount Pad Repair, Film Adhesive Method Replace damaged SM pads with film adhesive.
	4.7.3 Surface Mount BGA Pad Repair, Film Adhesive Replace damaged surface mount BGA pads with new dry film adhesive backed pads.
	4.7.4 Surface Mount BGA Pad Repair, w/Integral Via Replace damaged BGA pads with integral via. 4.7.5 Surface Mount BGA Pad Repair, w/Integral Via Replace damaged BGA pads with integral via.