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Outline
The guides in this section outline conductor, land, contact, and pad repairs for circuit board assemblies using varied techniques. Procedures address lifted conductors, damaged circuits, and broken lands with epoxy, dry film adhesive, welding, or jumper wires. Specialized methods cover inner layer and ground plane restoration, surface and inner layer circuit cuts. Edge contact repairs include epoxy, film adhesive, and plating approaches. Surface mount and BGA pad repairs are also detailed. Each method specifies appropriate materials and processes to restore electrical continuity, mechanical strength, and dimensional accuracy for long-term reliability. |
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Procedure to repair lifted conductors and circuits using liquid epoxy.
Procedure to repair lifted conductors and circuits using a dry film epoxy method.
Procedure covers repair of damaged conductors and circuits using liquid epoxy.
Procedure covers repair of damaged conductors and circuits using a dry film epoxy method.
Procedure covers repair of damaged conductors and circuits using a welding method.
Procedure covers repair of damaged conductors and circuits using a surface jumper wire.
Procedure covers repair of damaged conductors and circuits using a jumper wire feeding through the circuit board assembly.
Procedure covers repair damaged conductors and circuits on inner layers on circuit board assemblies.
Procedure covers repair of damage to surface ground planes on circuit board assemblies.
Procedure covers methods to cut surface conductors on circuit board assemblies.
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4.0 Conductor Repair Procedures
Procedures cover repair of conductors, lands, pads, edge contacts, surface and internal circuits.
Minimum Skill Level: N/A
Conformance Level: N/A
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