Circuitry/Plated Hole Repair

Circuitry and plated through holes are susceptible to damage during fabrication, assembly, or rework. At Circuit Technology Center, we apply IPC-recommended methods to restore full functionality and structural integrity with precision and reliability. Utilizing advanced repair techniques, such as the Foil Jumper Method for circuit trace restoration and precision eyelet installation for plated-through holes, we deliver results that replicate the original manufacturing quality. Our technicians also perform expert circuit modifications and upgrades, ensuring every project meets demanding electrical and cosmetic standards for high-reliability applications.

• IPC-recommended repair methods ensure quality and reliability
• Foil Jumper Method replicates original copper conductor fabrication
• Precision eyelet installation for plated through-hole restoration
• Expertise with multilayer boards and inner-layer connections
• Ability to execute complex circuit modifications and upgrades
• Skilled technicians with decades of repair and rework experience
• Trusted partner for aerospace, defense, and advanced electronics industries

• Circuit trace repair using pure copper foil jumpers, matching width and thickness
• Eyelet repair for damaged plated through holes
• Preservation of inner-layer integrity in multilayer PCBs
• Modifications including:
  * Addition of gold edge contacts
  * Signal path rerouting
  * Pad or via isolation
  * New component footprint integration
• Compliance with IPC-recommended rework and repair standards
• High-precision workmanship ensures electrical and cosmetic integrity

• 4.1.1 Lifted Conductor Repair, Epoxy Method
• 4.1.2 Lifted Conductor Repair, Film Adhesive Method
• 4.2.1 Conductor Repair, Foil Jumper, Epoxy Method
• 5.1 Plated Hole Repair, No Inner Layer Connection
• 5.3 Plated Hole Repair, Inner Layer Connection
• IPC-7711/7721 Rework, Modification, and Repair of Electronic Assemblies
• IPC-A-600 Acceptability of Printed Boards
• IPC-A-610 Acceptability of Electronic Assemblies
• IPC-J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies
• IPC-J-STD-004 Requirement for Soldering Fluxes
• IPC J-STD-006 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed
• IPC-JEDEC-J-STD-020 Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices
• IPC-JEDEC-J-STD-033 Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
• JESD625C.01_Requirements for Handling Electrostatic-Discharge-Sensitive (ESDS) Devices