New White Paper Examines Key Steps to Component Lead Tinning

New White Paper Examines Key Steps to Component Lead Tinning

November 1, 2022

The motivation behind component lead tinning is to facilitate the removal of gold plating to eliminate the risk of gold embrittlement, tin whisker mitigation, or processing components for applications that require refinishing with lead-free solder for RoHS compliance. The ideal method to facilitate the removal of gold plating and mitigate tin whiskers from SMT and through-hole components is to use the robotic hot solder dip (RHSD) process. This new white paper from Circuit Technology Center examines the key process considerations when undertaking this process.

The full white paper can be viewed here: https://www.circuitrework.com/features/1067.html

Send Documents *

Choose File No file chosen

Notes/Questions/Requests

Product Type
Assemblies Bare PCBs Other

Quantity

Delivery Schedule Request
3 Weeks 2 Weeks 1 Week
2-3 Days 1 Day

Security Check

* You may upload PDFs and other file types (max 4 MB each). For multiple files, zip them or send to info@circuitrework.com

Form Security
Our forms run on AWS with an industry-leading firewall. Data is encrypted at rest with AES-256 and in transit using TLS 1.2+.

News