White Paper Discusses Key Considerations for Electronic Component Tin Whisker Mitigation

Feb 27, 2023

White Paper Discusses Key Considerations for Electronic Component Tin Whisker Mitigation

The phenomenon of tin whiskers in printed circuit board assembly is a failure mechanism associated with electronic devices that use lead-free solder alloys containing low melting point elements such as tin, cadmium, or indium. In this white paper, Circuit Technology Center discusses a number of critical considerations when using an automated robotic hot solder dip process to mitigate tin whiskers before circuit board assembly.

See the full paper at: https://www.circuitrework.com/features/1037.html