Circuit Technology Center, Inc., a leader in high-reliability circuit board rework and component-level modification, has released a technical white paper: Cold Precision Milling for Underfilled BGA Component Removal. Available at www.circuitrework.com the paper addresses a critical challenge in safely removing underfilled Ball Grid Array (BGA) devices.
Traditional thermal removal methods for underfilled BGAs risk pad cratering, substrate delamination, and damage to nearby circuitry. The white paper introduces a low-thermal, mechanically-driven milling approach that minimizes heat input while controlling extraction forces, preserving board integrity and maximizing salvage potential.
It provides guidance on process parameters, fixturing, toolpath planning, debris management, and quality validation, helping engineers determine when cold milling is the optimal solution. The technique is particularly valuable for high-value, legacy, or thermally-sensitive assemblies.
Circuit Technology Center supports electronics engineers, quality teams, and test labs with actionable insights for rework, repair, and component salvage. With over 40 years of experience, IPC-certified technicians, and strict process controls, the company remains a trusted partner for mission-critical manufacturers worldwide.
Download the full white paper: www.circuitrework.com
