Outline
This procedure covers the robotic tinning of chip components.
Caution: Due to the need to completely control the rates of immersion and emersion of the chip component terminations and the dwell times in and between each process step, a robotic hot solder dip is recommended for chip component tinning. Semi-automatic or purely manual solder dipping processes may not be capable of completely controlling the rates of immersion and emersion of the chip component terminations and only provide approximate dwell dipping times in the solder bath. Greater variation in the process may cause a higher chance of damage, including latent reliability problems. Manual dipping required for full solder finish replacement is different than manual dipping currently practiced for meeting solderability requirements because of the increased need for 100% coverage on the chip component leads to preventing whisker growth. Certain electronic component package styles may not lend themselves to robotic hot solder dipping and may require alternative processing.
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Images and Figures![]()
Various Chip Components.
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Figure 1. Custom holding fixture tray.
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Figure 2. Robotic tinning system for controlled tinning of components.
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Procedure
Procedure
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10.2.2 Tinning, Chip/Discrete Components, Robotic
This procedure covers robotic tinning of chip and discrete components.