8.0 Rework Procedures

The guides in this section detail rework procedures for removing through-hole, chip, J-lead, and gull wing components from circuit board assemblies. Methods include point-to-point vacuum and solder fountain for through-hole parts; forked tip and hot tweezer techniques for chip components; conduction and hot gas approaches for J-lead and gull wing packages. Each procedure outlines the required tools, heating methods, and process controls to prevent damage to pads, traces, and surrounding components. These guidelines ensure safe, efficient component removal in repair or modification scenarios, supporting both precision rework and high-reliability assembly maintenance while preserving board integrity and meeting industry quality standards.