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8.0 Component Rework Procedures
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8.1.1 Component Removal, Through Hole Components, Vacuum Method
Procedure covers removal of through hole components using powered vacuum desoldering. |
8.1.2 Component Removal, Through Hole Components, Solder Fountain Method
Procedure covers removal of through hole components using a solder fountain system. |
8.2.1 Component Removal, Surface Mount Chip Components, Forked Tip Method
Procedure covers removal of chip components using a forked tip tool. |
8.2.2 Component Removal, Surface Mount Chip Components, Hot Tweezer Method
Procedure covers removal of chip components using a hot tweezer tool. |
8.3.1 Component Removal, Surface Mount J Lead Components, Conduction Method
Procedure covers removal of "J" lead components using direct contact conduction heating. |
8.3.2 Component Removal, Surface Mount J Lead Components, Hot Gas/Air Method
Procedure covers removal of "J" lead components using hot gas. |
8.4.1 Component Removal, Surface Mount Gull Wing Components, Conduction Method
Procedure covers removal of Gull Wing components using direct contact conduction heating. |
8.4.2 Component Removal, Surface Mount Gull Wing Components, Hot Gas/Air Method
Procedure covers removal of Gull Wing components using hot gas. |
This procedure is for reference only. Refer to the Procedure References listed above, or contact Circuit Technology Center for appropriate industry approved references.
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