Release Date: February 15, 2022
A new section, 10.0 Component Tinning Procedures, includes thirteen newly published procedures added to the popular online guidebook developed and written by Circuit Technology Center. This free online guidebook now contains 115 step-by-step procedures focused on circuit board assembly, repair, rework, and modification, plus many procedures focused on electronic component tinning and BGA re-balling. Most guidebook procedures include illustrations, photographs, and videos and follow popular IPC standards.
See section 10 of the guidebook at: www.circuitrework.com/guides/guides.html
