Release Date: May 7, 2020
Circuit Technology center is proud to announce its newest machine, the Robotic Hot Solder Dip. This machine is being run by three men who have studied this machine from the inside to the outside. The new Robotic Hot Solder Dip system is helping save the company time by being able to precisely do the same thing repeatedly without a predicament. The machine is ready to take on any project. It is ready to measure anything from dip depth, dwell times, temperatures, continuous chemical monitoring and proprietary process. The company has enjoyed working with the Robotic Hot Solder Dip system and will soon be getting a second. The steps that the Robotic Hot Solder Dip machine ensures are as follows:- Robotic-controlled six-axis dipping
- Solder dipping under a nitrogen blanket
- Solder-level sensing for accurate solder dipping
- Integral component wash and dry facility
- Preheating of components to negate the thermal shock
- Lead tinning/solder dip
- Terminal finish conversion
- Tin whisker elimination
- Lead-free solder joint weakness prevention
- Refinishing with tin/lead
- Lead-free and custom solder alloys
- Restoration of solderability
- Gold removal per J-STD-001
- RoHS compliance
