Release Date: May 19, 2020
For well over a decade Circuit Technology Center has been providing services to rework BGA devices. Their team has put together several tips to help manage this challenging activity and has written an article on the topic. This blog post details steps for the removal and replacement of a BGA component with 2600 balls at 1.0 mm pitch.The tips outline the removal process, site preparation options, paste application, profiling, and the use of corner spacers to reduce potato-chipping.
Learn more at www.circuitrework.com/features/609.html.
