5.0 Plated Hole Repair Procedures

The guides in this section cover methods for repairing damaged plated holes on circuit board assemblies. Procedures address holes without inner layer connections, using techniques to restore mechanical integrity and electrical function. Additional methods focus on plated holes with inner layer connections. Each repair process outlines the materials, tools, and steps needed to ensure restored conductivity, alignment, and durability while maintaining conformance to design specifications. These procedures are essential for preserving board performance when wear, manufacturing defects, or rework processes damage plated holes.

5.1 Plated Hole Repair, No Inner Layer Connection

Procedure to repair damaged plated holes without inner layer connections on circuit board assemblies.

5.2 Plated Hole Repair, Double Wall Method

Procedure to repair damaged plated holes that have an inner inner layer connection on circuit board assemblies.

5.3 Plated Hole Repair, Inner Layer Connection

Procedure to repair damaged plated holes that have an inner inner layer connection on circuit board assemblies.