5.1 Plated Hole Repair, No Inner Layer Connection Procedure covers the repair of a damaged plated hole that has no inner layer connection.

5.2 Plated Hole Repair, Double Wall Method Procedure covers use of an eyelet for the repair of a damaged pad on a plated hole with an inner layer connect.

5.3 Plated Hole Repair, Inner Layer Connection Procedure cover use of an eyelet to repair a plated through hole that has an inner layer connect.

This procedure is for reference only. Refer to the Procedure References listed above, or contact Circuit Technology Center for appropriate industry approved references.