5.0 Plated Hole Repair Procedures

The guides in this section cover methods for repairing damaged plated holes on circuit board assemblies. Procedures address holes without inner layer connections, using techniques to restore mechanical integrity and electrical function. Additional methods focus on plated holes with inner layer connections. Each repair process outlines the materials, tools, and steps needed to ensure restored conductivity, alignment, and durability while maintaining conformance to design specifications. These procedures are essential for preserving board performance when wear, manufacturing defects, or rework processes damage plated holes.

5.1 Plated Hole Repair, No Inner Layer Connection

Repair damaged plated through-holes with no inner layer connection using an eyelet. Learn drilling, preparation and eyelet forming methods to restore mechanical strength and solderability.

5.2 Plated Hole Repair, Double Wall Method

Restore plated through-holes using the double wall method for enhanced durability. Covers controlled drilling, eyelet sleeve installation and flaring techniques to ensure strong electrical continuity.

5.3 Plated Hole Repair, Inner Layer Connection

Repair plated through-holes with inner layer connections using precision reconstruction methods. Includes layer access, conductor restoration and eyelet installation to maintain multilayer integrity.