A customer once faced a costly problem - a pin snapped off at the base of an expensive pin grid array (PGA) component. The pin's shoulder was about twice the diameter of the main body and roughly 0.50" (12.7 mm) long. Could such damage be repaired?
The repair needed to survive both mechanical stress during insertion and thermal stress during soldering. The solution required creativity and precision.
A replacement pin with a matching diameter and gold plating - but a larger base - was sourced. The base was then machined to a depth of 0.050" (1.27 mm), creating a hollow cavity that could fit over the remaining stub. Both the machined pin and the stub were tinned with high-temperature solder.
A custom support fixture ensured perfect alignment while the new pin was soldered in place using a hot plate, flux, and a hot-air rework system. The repair was finished with a small bead of high-strength epoxy around the joint for added mechanical strength. (See Figure 2)
The result: a robust, reliable repair that restored full functionality to the costly component - saving time, money, and materials.
