We offer x-ray services for BGA component rework and other needs. Every circuit board we process for BGA rework is carefully inspected using a Dage X-ray system to ensure the BGA rework meets the highest quality levels. This system will pin point defects including solder joint shorts, opens, and voids.
X-ray inspection is a vital step in the BGA rework process. Fault finding is demanding so X-ray systems must provide, as a minimum, high resolution, high magnification and high contrast X-ray images.
We use a Dage XD7600 XiDAT X-ray system. It is a user-friendly machine and provides highly detailed real-time x-ray images. The extensive greyscale definition and oblique angle views deliver the superb detail demanded for proper diagnosis.