We offer x-ray services for BGA component rework and other needs. Every circuit board we process for BGA rework is carefully inspected using a Dage X-ray system to ensure the BGA rework meets the highest quality levels. This system will pin point defects including solder joint shorts, opens, and voids.
X-ray inspection is a vital step in the BGA rework process. Fault finding is demanding so X-ray systems must provide, as a minimum, high resolution, high magnification and high contrast X-ray images.
We use a Dage XD7600 XiDAT X-ray system. It is a user-friendly machine and provides highly detailed real-time x-ray images. The extensive greyscale definition and oblique angle views deliver the superb detail demanded for proper diagnosis.
"We're operating on a tight production schedule, with no time to waste. Circuit Technology Center has consistently delivered our boards back to us on time, and sometimes even ahead of schedule. This has helped us stick to deadlines. Thanks to their fast turnaround." S.L. Fremont, CA USA