X-Ray Inspection Services

All x-ray inspection is performed on a Dage Sub-Micron X-ray Inspection System.

We offer x-ray services for BGA component rework and other needs. Every circuit board we process for BGA rework is carefully inspected using a Dage X-ray system to ensure the BGA rework meets the highest quality levels. This system will pin point defects including solder joint shorts, opens, and voids.

X-ray inspection is a vital step in the BGA rework process. Fault finding is demanding so X-ray systems must provide, as a minimum, high resolution, high magnification and high contrast X-ray images.

We use a Dage XD7600 XiDAT X-ray system. It is a user-friendly machine and provides highly detailed real-time x-ray images. The extensive greyscale definition and oblique angle views deliver the superb detail demanded for proper diagnosis.

Large solder filled via voids.

Small epoxy filled via voids.

Automatic machine void measurement indicating the size of the void and % of the void compared to the ball diameter.

BGA solder balls not touching pads due to board warpage.

Bottom center shows incomplete solder fill in a through hole solder joint.