Printed Board Type: R
Skill Level: Advanced
Conformance Level: Medium
Revision: D
Revision Date: Jul 7, 2000

OUTLINE
This method is used to rebond a lifted land. Liquid epoxy is inserted under and around the land to bond it back down to the circuit board surface.

Lifted Land.

PROCEDURE

1. Clean the area.
   
   

2. Figure 1: Carefully apply a small amount of epoxy under the entire length of the lifted land.

   Remove any obstructions that prevent the lifted land from making contact with the base board surface.

   
   CAUTION
   Be careful while cleaning and removing all obstructions, not to stretch or damage the lifted land. 
   
   

3. Mix the epoxy.
   
   

4. Carefully apply a small amount of epoxy under the entire length of the lifted land. The tip of the knife or scraper may be used to apply the epoxy. (See Figure 1).
   
   
5. Place a piece of Kapton tape over the lifted land and press the land down into the epoxy and into contact with the base board material. (See Figure 2).
   
   

6. Figure 2: Place Kapton tape over the lifted land.

   Apply additional epoxy to the surface of the lifted land and to all sides as needed.
   
   
7. Cure the epoxy per Procedure 2.7 Epoxy Mixing and Handling.

   
   CAUTION
   Some components may be sensitive to high temperatures.

    

   
   NOTE
   Double sided and multilayer circuit Boards, may require an eyelet to restore the through connection. Refer to section 5.0 Plated Hole Procedures.

    

8. Carefully remove any excess epoxy inside the plated hole using a ball mill or drill bit. Turn the ball mill or drill bit by hand to prevent damage to the wall of the plated through hole.
   
   

9. Figure 3: Completed repair.

   Install the proper component and solder in place.

   
   NOTE
   This method is used to repair lifted lands, but the repaired lands may not have an intermetallic connection to the remaining plated hole. The solder joint of the replaced component will restore the integrity of the electrical connection or an eyelet or buss wire may be used. See Plated Hole Repair Procedures. 
   
   

10. Replace surface coating to match prior coating as required.

EVALUATION

1. Visual examination and tape test per IPC-TM-650 test method 2.4.1. (ANSI/IPC-FC-250A)
   
   
2. Electrical tests as applicable.