Printed Board Type: N/A
This method is used to rebond a lifted circuit. Liquid epoxy is inserted under and around the circuit to bond it back down to the circuit board surface. CAUTION This method should not be used to rebond a circuit that has been stretched or damaged.
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"Thanks for you and your recent work on my circuit board. When I slipped the board out of the box I was amazed at how meticulously it had been restored. And once the components were re-installed, it worked like a charm. I'll be recommending your services highly." J.T. Austin, TX USA Send us your comments |
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