4.1.1 Lifted Conductor Repair, Epoxy Seal Method

Printed Board Type: N/A
Skill Level: N/A
Conformance Level: N/A
Revision:
Revision Date:

OUTLINE
This method is used to rebond a lifted circuit. Liquid epoxy is inserted under and around the circuit to bond it back down to the circuit board surface.

CAUTION
This method should not be used to rebond a circuit that has been stretched or damaged. 

ACCEPTABILITY REFERENCES
IPC-A-600 2.0	Externally Observable Characteristics
IPC-A-610 10.0	Laminate Conditions
PROCEDURE REFERENCE
1.0	Foreword
2.1	Handling Electronic Assemblies
2.2	Cleaning
2.5	Baking and Preheating
2.7	Epoxy Mixing and Handling
IPC7721 4.1.1	Lifted Conductor Repair, Epoxy Seal

TOOLS & MATERIALS
Cleaner
Epoxy
Knife
Oven
Pick
Wipes

PROCEDURE

1. Clean the area.
   
   
2. Remove any obstructions that prevent the lifted circuit from making contact with the base board surface.
   
   CAUTION
   Be careful while cleaning and removing all obstructions, not to stretch or damage the lifted conductor.
   
   
3. Clean the area.
   
   
4. Mix the epoxy.
   
   

5. Figure 1: Apply a small amount of epoxy under the entire length of the lifted circuit.

   Carefully apply a small amount of epoxy under the entire length of the lifted circuit. The tip of a knife may be used to apply the epoxy. (See Figure 1).
   
   
6. Press the lifted circuit down into the epoxy and into contact with the base board material.
   
   
7. Apply additional epoxy to the surface of the lifted circuit and to all sides as needed.
   
   Cure the epoxy per Procedure 2.7 Epoxy Mixing and Handling.
   
   CAUTION
   Some components may be sensitive to high temperature.
   
   

8. Figure 2: Completed repair.

   Apply surface coating to match prior coating as required.

EVALUATION

1. Visual examination and tape test per IPC-TM-650 (ANSI/IPC-FC-250A) test method 2.4.1.
   
   
2. Electrical tests as applicable.