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2.5 Baking and Preheating
Outline
This procedure covers baking and preheating of printed boards and printed board assemblies to prepare the product for the subsequent operations. Included are steps for:
Caution Baking and preheating procedures must be carefully selected to ensure that temperature and time cycles used do not degrade the product. Environmental conditions must also be carefully considered to ensure that vapors, gases, etc., generated during the heating process do not contaminate the product's surfaces. Caution Some manufacturers of ceramic chip capacitors recommend that the Preheat Ramp Rate not exceed 2-4 degrees C/Sec. Caution To prevent fluxes or other contaminates from being baked onto the board surface, thoroughly clean the board or assembly prior to baking or preheating.
Minimum Skill Level - Intermediate
Recommended for technicians with skills in basic soldering and component rework, but may be inexperienced in general repair/rework procedures.
Conformance Level - High
This procedure most closely duplicates the physical characteristics of the original, and most probably complies with all the functional, environmental and serviceability factors.
This procedure is for reference only. Refer to the Procedure References listed above, or contact Circuit Technology Center for appropriate industry approved references.
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